面向三自由度压电快刀伺服的柔性机械位移放大器设计与控制研究

快速刀具伺服加工是微结构表面金刚石超精密切削加工的重要方法，通过宏微复合方式增加一套独立于数控车床之外的可实现高频往复运动的系统来实现超精密车削加工。本项目针对大行程、高精度的三自由度压电陶瓷快刀伺服的需求，创新性提出基于三级差动杠杆放大原理设计一种具有毫米级行程、纳米级精度的柔性机械位移放大器；拟通过研究各因素对刀具微纳进给的影响机理，揭示切削力波动等因素与迟滞非线性的内在联系，探索通过改进的率相关PI模型建立关于驱动电压、切削力、位移之间的多动态强耦合在线迟滞非线性模型，并设计出复合非线性PID进给控制算法；提出基于PVDF压电薄膜集成设计对未知扰动具有自适应抑制和补偿的刀具智能减振装置，建立基于实时切削状态的FTS全方位自感知—驱控一体化交互设计思想，从新的角度解决高频切削刀具减振与误差补偿难的问题。研究成果在微结构表面器件超精密加工设备等领域具有重要的理论与实践意义。

Fast tool servo machining is an important method of the diamond ultra-precision machining of microstructured surface. It is realized by adding a set of independent high frequency reciprocating system to the common CNC machine in a macro/micro composite manner. The project is proposed towards 3-DOF piezo-actuated fast tool servo with large stroke and high resolution, thus a type of flexible mechanical displacement amplifier with large magnification ratio is creatively designed, which is based on the principle of three-grade differential lever displacement amplification; after studying the mechanism between the cutting force variation and hysteresis nonlinearity, high dynamic and strong coupling hysteresis nonlinearity on-line model in terms of driving voltage, cutting force, cutting depth is established by using a modified rate-dependent Prandtl-Ishlinski model, a micro/nano feed control strategy is proposed on the basis of nonlinear PID control algorithm; an omnidirectional distributed intelligent piezoelectric thin-film device is designed, and a type of self-sensing drive-control integration interaction design method based on the real-time cutting status is put forward aims to achieve real-time adaptive tool vibration suppression and compensation control, which proposes a new idea for the hard nut of high-rate cutting tool vibration isolation and error compensation. The research achievements not only have important theoretical value, but also can provide support for the realization of domestic independent development and application of ultra-precision machining intelligent equipment towards the manufacture of military and civilian microstructured device surface.