银纳米颗粒焊膏低温无压连接铜基-SiC器件的无氧烧结机理研究

银纳米颗粒焊膏作为一种新型无铅芯片连接材料，具有优异的高温力学性能、高的导热率和低温无压烧结行为，可满足高功率集成度SiC功率模块的耐高温和散热要求，目前正受到广泛的关注。然而，银纳米颗粒焊膏的低温无压烧结行为依赖于含氧的烧结气氛，这将制约银纳米颗粒焊膏与低成本（裸）铜基板的互连应用。针对当前含氧气氛中银纳米颗粒焊膏与铜基板连接存在的由于铜氧化导致无法有效通过原子扩散形成可靠连接的问题，本项目将开展纳米颗粒焊膏的甲酸无氧烧结机理研究。通过制备具有特定有机物包覆壳的银纳米颗粒焊膏，旨在阐明甲酸气氛中特定有机物包覆壳的分解或烧蚀行为与银纳米颗粒焊膏烧结行为的内在关系，探究银纳米颗粒焊膏甲酸无氧烧结机理。银纳米颗粒焊膏的甲酸无氧烧结机理研究是银纳米颗粒焊膏低温无压连接铜基-SiC器件的关键科学问题，它对于拓宽银纳米颗粒焊膏的工业应用具有重要的研究意义。

As a novel lead-free die-attachment material, Ag nano-particles paste is attracting extensive attentions because of its excellent high-temperature mechanical properties, high thermal conductivity and low-temperature pressureless sintering, which can meet the high-temperature and heat-dissipation requirements of high-power integrated SiC power module. However, the low-temperature pressureless sintering behavior of Ag nano-particles paste depends on oxygen-containing sintering atmosphere, which will restrict the interconnection between Ag nano-particles paste and low-cost (bare) Cu substrate. Nowadays, an effective atomic diffusion bonding cannot be formed between sintered Ag and bare copper substrate due to the oxidation of the substrate surface under oxygen-containing sintering atmosphere, the sintering mechanism of Ag nano-particles paste in formic acid will be studied. The purpose of this study is to elucidate the relationships between the decomposition behaviors of specific organic shells and the sintering behavior of Ag nano-particle paste in formic acid and study the sintering mechanism of Ag nano-particles in formic acid.The project will carry out the anaerobic-sintering mechanism of Ag nano-particles paste and low-temperature pressureless bonding SiC devices to bare Cu substrate, and it is a key scientific problem of low-temperature and pressureless interconnection of Cu-sintered Ag-SiC interface. Therefore, the study on the anaerobic sintering behavior and mechanism of Ag nano-particles paste is very significant for industrial applications.