高性能、低成本和批量化生产是制约我国MEMS传感器产业化发展的关键因素，而创新且与IC Foundry兼容的MEMS制造技术是解决该问题的有效途径之一。为此，本项目开展一种单硅片单面TUB制造技术及其高性能器件研究。首先，建立体硅上微型释放孔结构形状、结构尺寸和拓扑方式与薄膜沉积气体分子之间的微观分子动力学模型，解决气体分子在体硅内微尺度受限空间内的输送-扩散-沉积机制和薄膜可控性沉积等关键科学问题，阐明TUB结构成型机理，开发出TUB制造技术；其次，开展全新结构的高性能微压传感器和MEMS麦克风研究，分别建立微压传感器和麦克风的理论模型，融合TUB技术研究两种器件的单硅片单面结构设计技术与制造方法，解决器件高性能、低成本和IC Foundry兼容性批量化生产难题；最后，开展器件性能测试与失效机理研究。本项目研究对于丰富我国MEMS制造技术促进MEMS器件发展具有重要的理论意义和实际价值。

High-performance, high-yield and low-cost volume production is the main factor restricting our industrial development of MEMS sensors, and innovative and IC-Foundry-compatible MEMS fabrication technology is an effective way to solve the problem. Aim to the abovementioned issues, a novel single-wafer-based single-side TUB (Thinfilm Under Bulk) fabrication process which is compatible with IC-Foundry standard process is developed in this project. Firstly, the microscopic molecular dynamics model between the micro releasing-hole structure-shape, structure-size and structure-topology and the deposited-film gas molecules is built, and then the key scientific problems are solved, such as the deposited-film gas molecular transport-diffusion-deposition mechanism in micro-scale confined spaces inside single-crystalline silicon (SCS) wafer and controllable deposition of thin-film under bulk-silicon. Further, the formation mechanism of TUB composite-structure is clarified. Secondly, based on TUB fabrication process, high-performance pressure sensor of sub-KPa measure-range and MEMS condenser microphones with novel structure configuration are developed, respectively. After structural mechanics models of the pressure sensor and the MEMS condenser microphone are established, respectively, the single-wafer-based front-side structure design technology and fabrication processes are considered with the TUB fabrication technology to solve the problems of the designed devices (i.e., pressure sensor and MEMS condenser microphone) high-performance, low-cost, high-volume production and IC-foundry-compatible fabrications. Finally, the relevant performance analysis and failure mechanism of the designed MEMS devices would be carry out. In short, this study would be important theoretical and practical significance for extending the MEMS silicon micromachining technology and promoting the development of MEMS device.