三维随形贴合迭片内嵌电极及其在有机微纳单晶场效应器件中的应用研究

三维随形贴合电子学是最近几年刚刚出现的一个柔性电子学分支。与传统刚性平面硅基电子学相比，三维随形贴合电子学能够非常舒适地契合在人体或者其他物体表面，在医疗，生物，能源，军事，航空、信息技术等领域有着巨大应用前景。受限于制备技术，目前国际上仅有少数几个课题组开展了相关研究。申请人设计了一种新型电极构型：迭片内嵌电极，不仅能满足三维贴合器件和电路的需求，还具有如下突出优势：1)源漏极、栅极、半导体层独立制备,可对各层分别优化，有利于获得最高性能器件；2)迭片过程为全干过程，避免溶液对半导体损伤；3)内嵌结构消除了电极台阶对单晶半导体器件和多层迭合的负面影响，使分子长程有序的柔性有机微纳单晶能被用作半导体材料；4)制备方法简单；5）电极制备与传统光刻技术相容，可制备大规模复杂电路。在迭片内嵌电极基础上，申请人将结合有机半导体微纳单晶，制备三维贴合场效应晶体管，为高性能三维贴合器件研究提供新思路。

3D conformal electronics is one important reasearch poject in flexible electronics. Different from the conventional rigid planar Si-based devices, 3D conformal devices enable intimate adherence on the arbitrary-shaped objects, and have shown a big potential for multifaceted applications in therapeutics, biotechnology, energy, military, and communication. The realization of 3D conformal circuit remains challenging due to the lack of fabrication technique for mechanically elastic and flexible electrodes, which could eliminate strain-introduced wrinkles through the adherence of a planar electrode onto a 3D surface. Here we propose an laminated embedded electrode design, which not only can realize 3D conformal devices and circuits, but also shows advantages as follows: .(1)The separated fabrication processes for source/drain electrodes, gate electrodes, and semiconductor, provide the chance to optimize each part for improved performance..(2)The peeling, transferring, and adherence are all-dry process. No solvent or water is introduced..(3)The embedded electrode configuration eliminates the step effect of bottom-contact single crystal transistor. .(4)The fabrication method is much simpler than the reported methods for comformal electrodes..(5)Gate and source/drain electrode patterns are compatible with the traditional photolightography technique, which shows the promising potential in complicated large-scale circuits..Based on the laminated embeded electrodes, the 3D conformal organic semiconductor micro/nanocrystal field-effect transistors will be fabricated, which provides a new idea for high-performance 3D conformal devices and circuits.