基于混合增材制造技术的三维电子电路集成制造基础研究

增材制造所代表的数字化生产模式正在引领全球制造业新的变革。混合增材制造技术是该领域的研究前沿之一，旨在集成多种类型制造工艺，加工不同类型材料，在增材制造过程中植入或制造功能元器件，并进行高性能三维电路互连，实现高附加值全功能电子产品结构和功能的一体化制造。该技术对于制造业升级和科技创新具有重要的社会意义和经济效益。本项目提出一种基于激光活化选择性化学镀的新型混合增材制造技术，重点解决混合增材制造技术中的多材料体系兼容性及可打印性、高性能导电材料的三维表面沉积和图形化等共性关键科学问题，具体研究内容包括：(1) 建立可活化型光固化树脂材料体系及其制备方法；(2) 探索光固化树脂表面激光活化选择性化学镀的基本机理与工艺方法，(3) 通过工艺集成，形成完善的混合增材制造工艺流程，制造三维立体电路、三维微波器件等进行直流和高频应用验证，为三维电子电路的设计与制造提供新的思路与方法。

Additive manufacturing technology is a typical digital manufacturing technology that brings great change to globe manufacturing industry. Hybrid additive manufacturing technology is the latest trend and highlight of additive manufacturing arena. It enables direct digital fabrication of high-value full-functional electronic products via integrating multiple advanced processes to handle different types of materials. This technology is accelerating scientific innovation and industrial upgrading of manufacturing industry. Here we propose a novel hybrid additive manufacturing technology based on laser-induced selective electroless plating. This method will solve two main scientific issues of hybrid additive manufacturing: (1) the compatibility and printability of multi-material system; (2) the three-dimensional deposition and patterning of high performance conductive materials. The solutions include: (1) develop laser-inducible stereolithography resins; (2) explore the fundamental mechanism of laser-induced selective electroless plating; (3) acquire process integration method and process chain of the hybrid additive manufacturing technology. A 3D structural electronic and a 3D microwave device will be designed and fabricated to prove the feasibility of this technology.