A review of organic and inorganic biomaterials for neural interfaces.
A review of organic and inorganic biomaterials for neural interfaces.
复制标题
用于神经接口的有机和无机生物材料的综述。
DOI：
10.1002/adma.201304496
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发表时间：
2014-03-26
影响因子：
29.4
通讯作者：
Abidian, Mohammad Reza
中科院分区：
文献类型：
--
作者：
Fattahi, Pouria;Yang, Guang;Kim, Gloria;Abidian, Mohammad Reza
纳米技术的最新进展产生了广泛的兴趣，应用纳米材料的神经假体。理想的神经接口应该与神经系统无缝集成，并长时间可靠地运行。因此，许多最初不是为神经接口开发的纳米材料成为检测神经信号和刺激神经元的有吸引力的候选者。在这篇全面的综述中，首先概述了最先进的微电极技术，重点介绍了这些微器件的材料特性。然后回顾了用于神经记录、刺激和生长的电活性纳米材料的进展，包括导电聚合物、碳纳米管、石墨烯、硅纳米线和有机-无机混合纳米材料。最后，技术和科学的挑战进行了讨论，这些纳米材料所面临的生物相容性，机械不匹配，和电气性能的发展，持久的功能神经接口。
Recent advances in nanotechnology have generated wide interest in applying nanomaterials for neural prostheses. An ideal neural interface should create seamless integration into the nervous system and performs reliably for long periods of time. As a result, many nanoscale materials not originally developed for neural interfaces become attractive candidates to detect neural signals and stimulate neurons. In this comprehensive review, an overview of state-of-the-art microelectrode technologies provided first, with focus on the material properties of these microdevices. The advancements in electro active nanomaterials are then reviewed, including conducting polymers, carbon nanotubes, graphene, silicon nanowires, and hybrid organic-inorganic nanomaterials, for neural recording, stimulation, and growth. Finally, technical and scientific challenges are discussed regarding biocompatibility, mechanical mismatch, and electrical properties faced by these nanomaterials for the development of long-lasting functional neural interfaces.
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影响因子：
15
作者：
Ang, Priscilla Kailian;Chen, Wei;Loh, Kian Ping
通讯作者：
Loh, Kian Ping
影响因子：
4
作者：
Asplund, M.;Thaning, E.;von Holst, H.
通讯作者：
von Holst, H.
影响因子：
4.9
作者：
Bianco, A;Kostarelos, K;Prato, M
通讯作者：
Prato, M
DOI：
10.1016/j.nano.2008.06.008
发表时间：
2009-03-01
影响因子：
5.4
作者：
Bardi, Giuseppe;Tognini, Paola;Pizzorusso, Tommaso
通讯作者：
Pizzorusso, Tommaso
影响因子：
19
作者：
Abidian, Mohammad Reza;Martin, David C.
通讯作者：
Martin, David C.