A new USP Class VI-compliant substrate for manufacturing disposable microfluidic devices.

A new USP Class VI-compliant substrate for manufacturing disposable microfluidic devices.
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DOI:
10.1039/b818873d
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发表时间:
2009-04-07
期刊:
影响因子:
6.1
通讯作者:
Chiu DT
Chiu DT
中科院分区:
工程技术1区
文献类型:
--
作者:
Kuo JS;Ng L;Yen GS;Lorenz RM;Schiro PG;Edgar JS;Zhao Y;Lim DS;Allen PB;Jeffries GD;Chiu DT

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