In situ measurement of the junction temperature of light emitting diodes using a flexible micro temperature sensor.
In situ measurement of the junction temperature of light emitting diodes using a flexible micro temperature sensor.
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DOI：
10.3390/s90705068
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
Hsieh WJ
中科院分区：
文献类型：
--
作者：
Lee CY;Su A;Liu YC;Fan WY;Hsieh WJ
本研究旨在制作一可挠性微电阻式温度感测器，以量测发光二极体（LED）之结温。通常使用热阻测量方法测量结温。这种方法是有限的，因为没有标准规范数据采集的时间。本工作提出了一种微型温度传感器，可以稳定和连续地测量温度，并具有重量轻，能够监测结温在真实的时间的优点。采用微机电系统（MEMS）技术，将温度传感器的尺寸减小到最小，该传感器采用不锈钢箔（SS-304，厚度为30 μm）作为衬底。柔性微电阻温度传感器可以固定在LED芯片和框架之间。LED的结温可以从温度和电阻之间的线性关系来测量。微型温度传感器的灵敏度为0.059 ± 0.004 Ω/°C。商用CREE® EZ 1000芯片的温度在热稳定时为119.97 °C，如使用微型温度传感器测量的;然而，当通过热阻测量测量时为126.9 °C。该微型温度传感器可代替热电阻测量，性能可靠。
This investigation aimed to fabricate a flexible micro resistive temperature sensor to measure the junction temperature of a light emitting diode (LED). The junction temperature is typically measured using a thermal resistance measurement approach. This approach is limited in that no standard regulates the timing of data capture. This work presents a micro temperature sensor that can measure temperature stably and continuously, and has the advantages of being lightweight and able to monitor junction temperatures in real time. Micro-electro-mechanical-systems (MEMS) technologies are employed to minimize the size of a temperature sensor that is constructed on a stainless steel foil substrate (SS-304 with 30 μm thickness). A flexible micro resistive temperature sensor can be fixed between the LED chip and the frame. The junction temperature of the LED can be measured from the linear relationship between the temperature and the resistance. The sensitivity of the micro temperature sensor is 0.059 ± 0.004 Ω/°C. The temperature of the commercial CREE® EZ1000 chip is 119.97 °C when it is thermally stable, as measured using the micro temperature sensor; however, it was 126.9 °C, when measured by thermal resistance measurement. The micro temperature sensor can be used to replace thermal resistance measurement and performs reliably.
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影响因子：
9.2
作者：
Lee, Chi-Yuan;Hsieh, Wei-Jung;Wu, Guan-Wei
通讯作者：
Wu, Guan-Wei
影响因子：
2.2
作者：
Hu, Jianzheng;Yang, Lianqiao;Shin, Moo Whan
通讯作者：
Shin, Moo Whan
DOI：
10.1109/tdmr.2004.827834
发表时间：
2004-06-01
影响因子：
2
作者：
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通讯作者：
Park, SW
影响因子：
4.9
作者：
Su, Ay;Liu, Y.;Chen, C.
通讯作者：
Chen, C.
影响因子：
8.4
作者：
Chen, XiaoXin;Rieth, Loren;Solzbacher, Florian
通讯作者：
Solzbacher, Florian