Transient Liquid Phase Bonding

本项目研究瞬时液相连接，目的是模拟这种连接过程，并确定工艺变量的影响。该方法旨在预测那些对瞬间液相结合作出反应的合金系统，并量化该过程的重要特征，如凝固动力学、固溶度和相平衡的影响、表面张力的影响、中间层的一般设计、通过这项研究，应该会形成基于材料体系的热力学和输运性质的夹层设计的明确理论基础。未来的潜在应用包括电子封装的瞬时液相连接、先进的金属基复合材料、陶瓷与金属的连接和反应金属连接。

This project examines transient liquid phase bonding with the aim of modeling this joining process and determining the effects of processing variables. The approach is aimed at predicting those alloy systems that respond to transient liquid phase bonding and quantifying important features of the process, such as the solidification kinetics, effects of solid solubility and phase equilibria, influence of surface tensions, generic design of interlayers, etc. Out of this research a clear rationale for design of interlayers based on thermodynamic and transport properties of the materials' systems should evolve. Potential future applications include transient liquid phase bonding of electronic packaging, advanced metal matrix composites, ceramic- to-metal bonding, and reactive metal joining.