Applications of Powder Materials for Joining

粉末材料连接应用

• 批准号: 9703531
• 负责人: Thomas Eagar
• 金额: --
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-08-15 至 2000-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9703531&HistoricalAwards=false
• 关键词: Applications; Powder; Materials; Joining

DMI-9703531 Eager This research project is to apply kinetic models of infiltration of powder materials to the more complicated systems and joint geometry of practical applications. The first objective is to experimentally determine the different combinations of the powder interlayers as well as the number and relative thickness of the interlayers. Next, with the aid of three dimensional printing (3DP) techniques, the powder interlayers will be patterned to regulate the local bonding areas, and to further reduce the residual stress in the joint. Computer modeling will be applied to calculate the level of residual stress in the interlayers, and provide indispensable information on selecting the powder interlayers and their geometries (patterning). Finally, a new bonding agent other than Ag-Cu-Ti will be developed. Such an alloy will provide improved heat and corrosion resistance as compared to the Ag-based alloys. Success of the research will create a better level of understanding of the physics and chemistry of advanced materials joining. By integrating designs of structures with joint configurations, this research will provide useful tools for the applications of advanced engineering materials.

DMI-9703531迫切希望将粉末材料的渗透动力学模型应用于更复杂的系统和节理几何的实际应用。第一个目标是通过实验确定粉末夹层的不同组合以及夹层的数量和相对厚度。接下来，借助三维打印(3DP)技术，将粉末夹层图案化，以调节局部结合区域，并进一步降低接头中的残余应力。计算机模拟将被应用于计算夹层中的残余应力水平，并提供关于选择粉末夹层及其几何形状(图案化)的必要信息。最后，开发了一种新型的粘结剂，以取代银-铜-钛。与银基合金相比，这种合金将提供更好的耐热性和耐腐蚀性。这项研究的成功将创造一个更好的理解先进材料连接的物理和化学水平。通过将结构设计与节点配置相结合，本研究将为先进工程材料的应用提供有用的工具。