Applications of Powder Materials for Joining

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DMI-9703531 Eager This research project is to apply kinetic models of infiltration of powder materials to the more complicated systems and joint geometry of practical applications. The first objective is to experimentally determine the different combinations of the powder interlayers as well as the number and relative thickness of the interlayers. Next, with the aid of three dimensional printing (3DP) techniques, the powder interlayers will be patterned to regulate the local bonding areas, and to further reduce the residual stress in the joint. Computer modeling will be applied to calculate the level of residual stress in the interlayers, and provide indispensable information on selecting the powder interlayers and their geometries (patterning). Finally, a new bonding agent other than Ag-Cu-Ti will be developed. Such an alloy will provide improved heat and corrosion resistance as compared to the Ag-based alloys. Success of the research will create a better level of understanding of the physics and chemistry of advanced materials joining. By integrating designs of structures with joint configurations, this research will provide useful tools for the applications of advanced engineering materials.