Novel Optical Interconnection Networks Using Optoelectronic Integrated Circuits

首席研究人员将设计并实验演示一种复杂而新颖的光子互连网络，该网络可以将2-D光学输入和输出的阵列。该网络是一种通用的容量(批量)多级混洗交换设计，使用高效的固定光学互连以及提供动态布线和信号再生的光电集成电路(OEIC)。OEIC是专门为获得在高带宽(100 MHz)上传输数据所需的性能而设计的。信号的路由由在其上承载数据信号或光功率的光束上编码的偏振来确定。此外，电路被优化以允许以2D阵列格式布置的类似开关的高密度。因为这个原因，这些OEIC将使用被PI发现与低功耗电路，因此使其本身适合于高阵列电路密度。正在调查的系统的另一个特点是，它将使用光学(而不是电力)供电用于阵列元件的集成InP光伏电池。光学供电具有以下优点：在阵列元件之间以低电平的电串扰供电，并且相对容易地分布在高密度网络中，其中与远程像素的互连可能是一个严重的问题。该项目涉及南加州大学两个小组之间的密切合作--其中一个小组的专业知识已在互联体系结构领域得到展示设计，另一家专门从事InP基材料的OEIC的设计和制造。成功完成项目目标所需的学科组合将导致在最先进的光子互连网络。此外，该计划还将与光电子行业建立合作伙伴关系，增强我们最终实现商用光子交换网络的能力，使用诸如在这里求婚。

The Principal Investigators will design and experimentally demonstrate a sophisticated and novel photonic interconnection network that interconnects 2-D arrays of optical inputs and outputs. The network is a general volume (bulk) multistage shuffle exchange design using high efficiency fixed optical interconnections along with optoelectronic integrated circuits (OEICs) to provide dynamic routing and signal regeneration. The OEICs are designed specifically to attain the performance necessary to carry data at high bandwidths ( 100 MHz). The routing of signals is determined by the polarization encoded on the light beam on which the data signal or optical power is carried. Furthermore, the circuits are optimized to allow for a high density of similar switches arranged in a 2D array format. For this reason, the OEICs will be fabricated using Ino.53GaO.47As which has been found by the PIs to be compatible with very low power dissipation circuits, hence lending itself to high array circuit densities. Another feature of the system under investigation is that it will be optically (rather than electrically) powered using integrated InP photovoltaic cells for the array elements. Optical powering has the advantages of supplying power with a low level of electrical cross-talk between array elements, and is relatively easily distributed in high density networks where interconnection to remote pixels can be a significant problem. The program involves a close collaboration between two groups at USC -- one whose expertise has been demonstrated in the field of interconnection architecture design, and the other which specializes in the design and fabrication of OEICs in InP-based materials. The combination of disciplines necessary for the successful completion of the project goals will lead to significant advances in the state- of-the-art of photonic interconnection networks. Furthermore, this program is to be complemented by a partnership with photonics industry, enhancing our ability to eventually realize commercial photonic switching networks using advanced device technologies such as those proposed here.