Picoliter Solder Droplet Dispensing for Electronics Manufacturing

这项研究致力于将焊料应用于印刷电路板和其他基板，这是一种新的灵活方法，可以在许多应用中使用，使用喷墨打印技术直接应用熔融焊料液滴。喷墨打印系统使用喷出的微小墨滴来产生图像。这些设备产生高度可重复性和可控性的水滴，从而可以根据数字存储的图像数据在特定位置打印水滴。这项研究可能会衍生出几种不同的应用。这些措施包括：(1)表面贴装返工站，用于更换不良或组装不当的部件，结合了高精度和自动化的焊滴分配系统；(2)自动化在线焊接工艺，可将一种或多种类型的焊料和助焊剂分配到电子印刷电路板焊盘上，用于键合高管脚数、细间距的表面安装部件；以及(3)用于特殊应用的系统，例如将焊滴分配到倒装芯片焊点、用于带式自动键合(TAB)的凸块和用于柔性电路互连的焊盘。

This research addresses solder application to printed circuit boards and other substrates with a new flexible approach that can be employed in numerous applications, directed application of molten solder droplets, using ink-jet printing technology. Ink-jet printing systems use the ejection of tiny drops of ink to produce an image. The devices produce highly reproducible and controllable drops, so that a drop may be printed at a specific location according to digitally stored image data. Several distinct applications could evolve from this research. These include: (1) A surface mount rework station for replacement of bad, or improperly assembled components that incorporates a highly accurate and automated solder droplet dispensing system; (2) An automated in-line solder process that would dispense one or more types of solder, and flux, onto electronic printed circuit board pads for bonding of high pin count, fine pitch surface mount components; and (3) Systems for special applications, such as dispensing solder droplets onto Flip Chip bonds, bumps for Tape Automated Bonding (TAB), and solder pads for flex circuit interconnects.