Picoliter Solder Droplet Dispensing for Electronics Manufacturing

用于电子制造的皮升焊滴点胶

• 批准号: 9203071
• 负责人: David Wallace
• 金额: $ 24.26万
• 依托单位: MicroFab Technologies Inc
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1992
• 资助国家: 美国
• 起止时间: 1992-10-01 至 1995-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9203071&HistoricalAwards=false
• 关键词: Picoliter; Solder; Droplet; Dispensing; Electronics

This research addresses a new solder application method, using ink-jet printing technology, to produce and place molten solder droplets onto various substrates. Ink-jet based solder deposition would be low cost (no masks or screens are required), flexible (the image is stored and formed digitally), suitable for manufacturing environment (does not operate in a vacuum like liquid metal ion systems), highly repeatable, and high resolution. Specific applications would include formation of solder bumps on integrated circuits for TAB or flip-chip interconnection, or selective application of top metallization for fine pitch surface mount assembly, chip-on-board (COB), or multichip modules (MCM's). Direct-write solder technology would be ideal for rework, including both chip or package replacement, and metallization or personalization of circuitry for high density interconnection (HDI) substrates.

这项研究提出了一种新的焊料应用方法， 采用喷墨打印技术，生产和放置熔融 焊料滴到各种衬底上。 喷墨基焊料 沉积将是低成本的（不需要掩模或丝网）， 灵活（图像以数字方式存储和形成），适用于 制造环境（不像在真空中操作） 液态金属离子系统），高度可重复性， 分辨率 具体应用包括： 用于TAB或倒装芯片的集成电路上的焊料凸块 互连或顶部金属化的选择性应用 用于细间距表面贴装组件、板上芯片（COB），或 多芯片模块（MCM）。 直写焊接技术将 是返工的理想选择，包括芯片或封装更换， 以及电路的金属化或个性化， 高密度互连（HDI）衬底。