Picoliter Solder Droplet Dispensing for Electronics Manufacturing

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This research addresses a new solder application method, using ink-jet printing technology, to produce and place molten solder droplets onto various substrates. Ink-jet based solder deposition would be low cost (no masks or screens are required), flexible (the image is stored and formed digitally), suitable for manufacturing environment (does not operate in a vacuum like liquid metal ion systems), highly repeatable, and high resolution. Specific applications would include formation of solder bumps on integrated circuits for TAB or flip-chip interconnection, or selective application of top metallization for fine pitch surface mount assembly, chip-on-board (COB), or multichip modules (MCM's). Direct-write solder technology would be ideal for rework, including both chip or package replacement, and metallization or personalization of circuitry for high density interconnection (HDI) substrates.