RIA: Characterizaton of Interfacial Fracture Toughness

提出的研究目标是建立一个用于测量界面韧性的界面断裂力学模型。利用该模型，将对不同加载条件下的双材料边缘裂纹试样进行解析和数值分析，以提供从实验测量中提取韧性数据所必需的k -校准关系。这项研究对于从实验测量中提取界面韧性数据以及评估含有相同类型界面的给定结构的断裂韧性至关重要。它可以为工程材料和结构（如层压板、粘合剂和焊点）的设计、加工和失效预防提供有价值的信息。

The objective of the proposed research is to develop a fracture mechanics model of interfaces for measuring interface toughness. Using this model, analytical and numerical analyses will be carried out on an edge-cracked bimaterial specimen under various loading conditions to provide the K-calibration relations, which are necessary for extracting toughness data from experimental measurements. This research is essential for extracting interface toughness data from experimental measurements, as well as for assessing the fracture toughness for a given structure containing the same type of interface. It can provide valuable information for design, processing and failure prevention of engineering materials and structures, such as laminates, adhesives and solder joints.