Engineering Faculty Internship: Dynamics of Surface Mount Device Placement and Reflow During Printed Circuit Board Assembly

该项目旨在对一家制造工厂进行研究，该工厂处理表面贴装技术，并开发在回流过程之前和之后监测表面贴装组件放置所需的工艺。研究工作的目的是开发在线过程监视器，并验证这些监视器是否有助于控制回流过程完成后印刷电路板上细间距表面贴装组件的放置。

The project is designed to conduct studies at a manufacturing facility dealing with surface mount technology and the development of the processes required to monitor the placement of surface mount components, before and after the reflow process. The intent of the research effort is to develop in line process monitors and to verify if such monitors are useful in controlling the placement of fine pitch surface mount components on printed circuit boards after the reflow process is complete.