High-Speed, Monolayer Sensitivity Scanning Microcalorimetry for Solid-Solid Interface and Surface Studies

9419604将开展艾伦研究，探索和研究扫描量热法的新方法。所提出的方法对于直接获得界面、表面和近表面区域的反应小焓的量化值是一种非常有效的方法。我们期望达到相当于亚单分子层解吸热的灵敏度，以证明该方法在测量固体/固体反应和表面过程中产生的极少量热以及内部微晶过程的低热方面的实用性。我们将测量界面反应的动力学，如硅化物在埋藏界面的成核，并开始研究近表面过程，如离子注入后硅中的点缺陷湮灭和空位合并。%该计划的主要目标是开发一种基于现代薄膜技术的高灵敏度微量热计，并展示其在获得有关表面科学现象的基本材料科学信息方面的有用信息，如表面重构的热、相变以及表面化学过程的个别微观性质，如原子层外延过程中吸附物种的分解。该计划的一个重要特点是在材料和工艺研究的基础和技术方面对研究生和本科生进行培训。这项研究将有助于提高用于计算、信息处理和远程通信的先进器件和集成电路的综合性能。***

9419604 Allen Research will be carried out to explore and study a new approach to scanning calorimetry. The proposed approach is potentially a very powerful method for directly obtaining quantitative values for small enthalpy of reactions at interfaces, surfaces and near surface regions. We expect to achieve sensitivity equivalent to the enthalpy of submonolayer desorption, to demonstrate the utility of the method for the measurement of extremely small amounts of heat generated during solid/solid reactions and surface processes as well as low enthalpy of internal microcrystalline processes. We will measure the kinetics of interface reactions such as the nucleation of silicides at buried interfaces, and begin a study of near surface processes, such as point defect annihilation and coalescence of vacancies in silicon following ion implantation. %%% The primary goal of this program is to develop a high sensitivity microcalorimeter based on modern thin film techniques, and to demonstrate its useful in gaining fundamental materials science information on surface science phenomena such as the enthalpy of surface reconstruction, phase transformations, and individual microscopic properties of surface chemistry processes such as the decomposition of adsorbed species during atomic layer epitaxy. An important feature of the program is the training of graduate and undergraduate students in a fundamentally and technologically significant area of materials and processing research. This research will contribute to improving the general perform ance of advanced devices and integrated circuits used in computing, information processing, and tele communica tions. ***