International Postdoctoral Fellows: Micromechanics of Ferroelectric Material and Electronic Packaging

9423964黄，国际初级研究员和博士后研究员计划使美国科学家和工程师能够在国外进行三到二十四个月的研究。该项目的奖项提供了联合研究的机会，并提供了使用国外独特或互补的设施、专业知识和实验条件的机会。这一奖项将支持杨永刚博士为期五个月的博士后访问，与清华大学的魏洋博士和黄克志博士在中华人民共和国中国合作。该项目的资金将来自东亚-太平洋计划。黄博士与清华大学的合作旨在增进我们对电子封装中的微观力学问题以及“智能材料”的本构建模的基本理解，并推进可靠的电子封装的优化设计。该项目的具体目标是：1)研究导电胶在全温度范围内的失效机制，重点是高度受限的失效；2)研究导电胶由于热疲劳而导致的界面退化机制，重点是热循环下的缺陷演变；以及3)铁电材料的建模，特别关注微观现象与宏观性能之间的关系。***

9423964 Huang The International Junior Investigator and Postdoctoral Fellows Program enables U.S. scientists and engineers to conduct three to twenty-four months of research abroad. The program's awards provide opportunities for joint research, and the use of unique or complementary facilities, expertise and experimental conditions abroad. This award will support a five-month postdoctoral research visit by Dr. Yonggang Young Huang to work with Drs. Wei Yang and Keh-Chih Hwang of Tsinghua University in the People's Republic of China. Funding for this project will come from the East Asia-Pacific Program. This collaboration between Dr. Huang and Tsinghua University is designed to increase our fundamental understanding of micromechanics issues in electronic packaging and in constitutive modeling of "intelligent materials," plus advance the optimum design of reliable electronic packaging. The specific objectives of the project are: 1) To study the failure mechanisms of conductive adhesives over the full temperature range, with emphasis on highly constrained failure; 2) To study the interface degradation mechanisms of conductive adhesives due to thermal fatigue, with emphasis on defect evolution under thermal cycling; and 3) To model ferroelectric materials, with special focus on the relation between microscale phenomena and macroscopic properties. ***