U.S.-Germany Cooperative Research on the Heat- Resistant Active Brazing of Silicon-Nitride

该奖项支持伊利诺伊大学芝加哥分校的J.E.Indaco chea教授和研究生与德国亚琛工业大学材料科学研究所的Erich Lugscheider教授和其他人在材料工程研究方面进行合作。他们联合研究的目标是改进在高温和其他恶劣环境下粘接非氧化物陶瓷所涉及的工艺过程。特别是，他们计划开发一种填充材料，并定义连接氮化硅的连接程序。他们将评估三种技术，以便于制造和陶瓷接头的稳定性。为了充分利用高性能陶瓷和复合材料的技术优势，有必要提供足够的技术将这些材料连接到其他物质上。这项合作研究利用了这家德国集团在合金设计、工艺设计和优化方面的技术专长。他们宝贵的欧洲工业合作伙伴关系使他们能够获得工业大规模生产设备，从而加强了这一点。这家美国集团可以很容易地获得必要的显微、分析和计算设施，并且在微观结构评估和相变方面拥有专业知识，这与德国的专业知识相辅相成。他们共同努力的结果预计将产生一个数据库和模型，可以设计填充材料，并根据基板、温度水平和粘接使用环境的规格确定有效的连接工艺。

This award supports Professor J. E. Indacochea and a graduate student of the University of Illinois at Chicago to collaborate in materials engineering research with Professor Erich Lugscheider and others of the Materials Science Institute of the Technical University of Aachen, Germany. The objectives of their joint research are to improve the technological processes involved in bonding non-oxide ceramics at elevated temperatures and in otherwise hostile environments. In particular, they plan to develop a filler material and define a joining procedure to bond silicon nitride. They will evaluate three techniques for ease of fabrication and the stability of the ceramic joint. In order to capitalize on the technological benefits of high performance ceramics and composite materials, it is necessary to provide adequate techniques for joining these materials to other substances. This collaborative research takes advantage of the German group's technological expertise in alloy design, process design and optimization. It is enhanced by their valuable European industrial partnerships, which give them access to industrial mass production equipment. The U.S. group has easy access to necessary microscopic, analytical and computing facilities, and it has expertise in microstructure evaluations and phase transformations which complement the German expertise. The results of their joint effort are expected to produce a data base and model that could design the filler material and identify an effective joining process based on specifications of substrate, temperature levels and service environment for the bonding.