Applications of Powder Materials for Joining

这个研究项目是将粉末材料的渗透动力学模型应用到更复杂的系统和关节几何的实际应用中。第一个目标是通过实验确定粉末中间层的不同组合以及中间层的数量和相对厚度。接下来，借助三维打印（3DP）技术，将对粉末中间层进行图图化，以调节局部粘合区域，并进一步减少接头中的残余应力。计算机建模将应用于计算中间层的残余应力水平，并为选择粉末中间层及其几何形状（图案）提供不可或缺的信息。最后，开发出一种除Ag-Cu-Ti以外的新型键合剂。与银基合金相比，这种合金将提供更好的耐热性和耐腐蚀性。这项研究的成功将使人们更好地理解先进材料连接的物理和化学。通过将结构设计与节点配置相结合，本研究将为先进工程材料的应用提供有用的工具。

DMI-9703531 Eager This research project is to apply kinetic models of infiltration of powder materials to the more complicated systems and joint geometry of practical applications. The first objective is to experimentally determine the different combinations of the powder interlayers as well as the number and relative thickness of the interlayers. Next, with the aid of three dimensional printing (3DP) techniques, the powder interlayers will be patterned to regulate the local bonding areas, and to further reduce the residual stress in the joint. Computer modeling will be applied to calculate the level of residual stress in the interlayers, and provide indispensable information on selecting the powder interlayers and their geometries (patterning). Finally, a new bonding agent other than Ag-Cu-Ti will be developed. Such an alloy will provide improved heat and corrosion resistance as compared to the Ag-based alloys. Success of the research will create a better level of understanding of the physics and chemistry of advanced materials joining. By integrating designs of structures with joint configurations, this research will provide useful tools for the applications of advanced engineering materials.