Transient Liquid Phase Bonding

瞬时液相键合

• 批准号: 9001691
• 负责人: Thomas Eagar
• 金额: --
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing grant
• 财政年份: 1990
• 资助国家: 美国
• 起止时间: 1990-05-15 至 1993-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9001691&HistoricalAwards=false
• 关键词: Transient; Liquid; Phase; Bonding

This project examines transient liquid phase bonding with the aim of modeling this joining process and determining the effects of processing variables. The approach is aimed at predicting those alloy systems that respond to transient liquid phase bonding and quantifying important features of the process, such as the solidification kinetics, effects of solid solubility and phase equilibria, influence of surface tensions, generic design of interlayers, etc. Out of this research a clear rationale for design of interlayers based on thermodynamic and transport properties of the materials' systems should evolve. Potential future applications include transient liquid phase bonding of electronic packaging, advanced metal matrix composites, ceramic- to-metal bonding, and reactive metal joining.

本项目研究瞬时液相连接，目的是 模拟这种连接过程并确定 处理变量。 该方法旨在预测这些 响应于瞬时液相结合的合金系统， 量化过程的重要特征，例如 凝固动力学，固溶度和相的影响 平衡，表面张力的影响，通用设计， 中间层等。在这项研究中， 基于热力学和输运的夹层设计 材料系统的性能应该进化。 潜在 未来的应用包括瞬时液相结合， 电子封装、先进金属基复合材料、陶瓷- 金属间键合和活性金属接合。