Assembly of Functionally-enhanced MEMs by Laser Liftoff and Transfer of Epitaxial Piezoelectric Thin Films

摘要EEC-9812906 SandsU CAL Berkeley： 这是一个探索性研究项目，以加强工业/大学合作研究中心的传感器和执行器。该研究利用了一种新的激光剥离过程的最新发展，用于集成功能薄膜材料和异质结构与微机电系统（MEMS）组装到几乎任何基板上，使两个或不同的材料系统在组装前单独优化处理。这种工艺适用于许多功能薄膜材料和异质结构。剥离工艺的显著特点是薄界面层穿过透明衬底的纳秒时间尺度分解。该过程非常快速，可以在实验室环境中进行，不需要特殊的牺牲层，并且膜表面处的峰值温度基本上低于分解温度，并且容易实现选定区域的剥离。

Abstract EEC-9812906SandsU CAL Berkeley: This is an Exploratory Research Project to augment the Industry/University Cooperative Reseach Center for Sensors and Actuators.The research exploits the recent development of a novel laser liftoff process for the integration of functional thin-film materials and heterostructures with Micro-ElectroMechanical Systems (MEMS) assembled onto virtually any substrate, enabling separate optimized processing of two or disparate materials systems prior to assembly. This process is suited to many functional thin film materials and heterostructures .The salient feature of the liftoff process is the nanosecond-timescale decomposition of a thin interfacial layer through the transparent substrate. The process is very rapid, can be performed in the laboratory ambient, no special sacrificial layer is required, and the peak temperature at the film surface is substantially below the decomposition temperature, and the selected-area liftoff is readily achieved.