Next-Generation Re-Configurable Wiresaw for Wafer Slicing and On-Line Real-Time Metrology

此拨款将用于发展线锯技术的理论模型和实验研究。将研究与在线和实时计量集成的下一代可重构线锯的研究问题和实现，例如线磨损的实时监测和线网管理。整合“滚压”机制、弹性流体力学、断裂力学、塑性、振动和刚度控制的创新建模将有助于线锯制造过程的集成建模。这种合理的理论方法对于大型晶圆的生产尤其重要，可以避免以牺牲质量和一致性为代价的典型的试错方法。研究目标包括：(1)研究新型敏捷线锯的理论和实践问题，具有集成的监测和计量，可以适应不同的材料，尺寸，配置和其他特征；(2)开发用于钢丝磨损现场实时监测和钢丝网在线管理的传感器；(3)研究利用相移技术实现全晶圆表面阴影云纹测量的高精度和高分辨率；(4)线锯机智能MEMS传感器的设计与应用。该研究还包括学术机构与工业伙伴之间的合作，以加强研究与工业应用的相关性。这项合作研究将有可能为下一代线锯建立一种优越的技术。如果成功，这项研究的结果将使我们能够进一步发展线锯技术，并通过为微电子、MEMS和微系统的制造提供高质量和低成本的基板，促进半导体技术的进步。智能MEMS传感器的线锯研究成果和应用可用于开发用于晶圆生产的下一代可重构智能线锯；以及光学计量学，如带相移的阴影云纹技术，以增强对线锯制造过程参数和晶圆表面拓扑结构的原位和后处理测量和控制能力。此外，在基础研究和技术进步方面的突破将在制造大直径硅晶圆以及碳化硅，铌酸锂，III-V和II-VI半导体，陶瓷和复合材料方面提供非常有前途的使能技术。

This grant provides funding to develop the theoretical modeling as well as experimental research of the wiresaw technology. Research issues and the implementation of the next-generation re-configurable wiresaw integrated with on-line and real-time metrology, such as the real-time monitoring of wire wear and wire web management, will be investigated. Innovative modeling integrating the "rolling-indenting" mechanism, elasto-hydrodynamics, fracture mechanics, plasticity, vibration, and stiffness control will facilitate the integrated modeling of the wiresaw manufacturing process. Such sound theoretical methodology is particularly important for the production of large wafers to avoid typical trial-and-error approaches at the expense of quality and consistency. The research objectives include: (1) investigation of both theoretical and practical issues of the novel agile wiresaw, with integrated monitoring and metrology that can be adapted to slice different materials, sizes, configuration, and other characteristics; (2) development of in-situ, real-time sensors for monitoring of wire wear and on-line wire web management; (3) research of the next-generation shadow moire measurement of the whole wafer surface using the phase shifting technique to render high precision and resolution; and (4) design and application of smart MEMS transducers for the wiresaw machine. The research also features collaboration between academic institution with industrial partners to strengthen the relevance of this research and application in industry. This collaborative research will make it possible to establish a superior technology for the next-generation wiresaw.If successful, the results of this research will enable us to further the technology of wiresaw and to facilitate the advancement of semiconductor technology by providing high-quality and low-cost substrates in the fabrication of microelectronics, MEMS, and microsystems. The wiresaw research results and applications of smart MEMS transducers can be utilized for the development of the next-generation, re-configurable, and smart wiresaw for wafer production; as well as optical metrology, such as shadow moire technique with phase shifting, to enhance the capability of both in-situ and post-process measurements and controls of wiresaw manufacturing process parameters and topology of wafer surfaces. In addition, the breakthrough in fundamental research and technology advancement will feature a very promising enabling technology in the manufacturing of not only large diameter silicon wafers but also silicon carbide, lithium niobate, III-V and II-VI semiconductors, ceramic, and composite materials.