GOALI/IUCP: Modeling and Control of Wire Saw Manufacturing Processes

9634889 Kao线锯是一种切割石材和木材的技术，已使用多年，但今天用于切割用于光伏电池和半导体的硅晶片。这些锯片使用多根钢丝和研磨浆，从表面光洁度极佳的硅锭中生产出较薄(约300-400微米)、相对较大(200-300毫米)的晶片。这是纽约州立大学石溪分校和GT Equipment Technologies，Inc.之间的合作研究项目，旨在为线锯工艺开发模型，以设计和制造能够生产厚度小于300微米、切割损耗在150-200微米之间的晶片的下一代线锯。技术方法是开发锯切过程的力学和动力学模型，该模型可用于设计刚度和张力控制策略，以提高切片精度。在工业合作伙伴设计原型之前，将使用实验和独特的散斑激光测量技术来验证模型和控制。该项目将为电子制造中的这一重要工艺提供一个基本模型，从而在用硅锭制造晶片时提高质量和生产率。这种设备的集成设计和控制方法承诺减少通过开槽损失和缺陷产品造成的浪费，为设备制造商在全球市场竞争提供技术领先。

9634889 Kao Wire sawing is a technology that has been used for may years to cut stone and wood, but today is used to slice the silicon wafers used in photovoltaic cells and semiconductors. These saws use multiple wires and an abrasive slurry to produce thin (on the order of 300-400 micron), relatively large diameter (200-300 millimeter) wafers from silicon ingots with excellent surface finish. This Grant Opportunity for Academic Liaison with Industry cooperative research project between the State University of New York at Stony Brook and GT Equipment Technologies, Inc. will develop models for the wire sawing process to design and build the next generation of wire saw capable of producing wafers less than 300 microns thick with kerf losses of between 150-200 microns. The technical approach will be to develop a mechanics and dynamic model of the sawing process that can be used to design a stiffness and tension control strategy for improving slicing accuracy. Experiments and unique speckle laser measurement techniques will be used to validate the model and control prior to the industrial partner's design of a prototype. This project will provide a fundamental model for this important process in electronics manufacture, leading to improved quality and productivity when fabricating wafers from silicon ingots. An integrated design and control approach for this equipment promises to reduce waste through both kerf losses and defective products, giving a technological lead to equipment manufactures competing in global markets.