SBIR Phase II: Novel Joining Method for Self-Assembly of Reliable Three Dimensional Micro-Electro-Mechanical Systems

这个小型企业创新研究(SBIR)第二阶段项目将继续开发第一阶段探索的焊料自组装工艺，它将建立在第一阶段成功成果的基础上，该成果展示了使用焊料将二维表面微机械微电子机械系统(MEMS)自组装成有用的三维结构。这一概念是MEMS组装发展的下一步。第二阶段的总体目标是将该技术从实验室环境转移到易于理解并具有极高产量的商业生产过程。来自工业界和教育界的研究人员将参与其中，并将使用最先进的设备。已经确定了一些有前途的商业应用，与潜在商业合作伙伴的讨论表明有兴趣将这项技术商业化。

This Small Business Innovation Research (SBIR) Phase II project will continue to develop a solder self-assembly process that was the concept explored in Phase I. It will build upon the successful Phase I results that demonstrated the use of solder to self-assemble two-dimensional surface micromachined Micro-Electro-Mechanical Systems (MEMS) into useful three-dimensional structures. This concept is a next step in the evolution of MEMS assembly. The overall objective of Phase II is to move the technology from the lab environment to a commercial production process that is well understood and has excellent yield. Research personnel from industry and education are involved and state-of-the-art equipment will be utilized.A number of promising commercial applications have been identified and discussions with potential commercial partners suggest interest in commercializing this technology.