Integral Embedded Capacitor Component from Ultra-High Dielectric Constant Polymer-Conductive Filler Nano-Composite

整体式无源元件被认为是当前分立无源元件的潜在替代品，在系统成本、尺寸、功能和可靠性方面都有好处。对于嵌入式电容器应用，聚合物-陶瓷纳米复合材料已被作为高介电常数(K)材料进行了研究。然而，聚合物-陶瓷复合材料在有机基板上的应用存在一些技术障碍，如介电常数(150)有限，与基板的粘附性差。初步结果表明，有效介电常数高达2000以上，附着力几乎与整齐的聚合物基质相同。为了成功地将这种超高K材料应用于下一代先进电子封装中的整体电容器应用，拟议中的项目将在以下问题上进行基础研究：超高K聚合物导电填料复合材料配方的优化：将继续努力优化配方，以实现潜在的更高材料性能。整体电容器组件的建模：通过提供关键材料和工艺参数的定量估计，这可以帮助整体电容器组件的设计和加工。使用开发的超高K聚合物导电填充复合材料的整体电容器组件的加工性：整体电容器的原型将由液体或薄膜复合材料构建。采用该工艺制造的集成电容器的可靠性性能：介电常数和粘接强度等电性能的稳定性/退化将在850C185%RH老化、温度、湿度和偏压(THB)老化、液-液热冲击(LLTC)和空气-空气热循环(AATC)等情况下进行监测。预期的研究结果将丰富对基于超高K介质材料的集成电容器组件的基本认识，这将对实现集成电容器在下一代微电子封装中的应用至关重要。

Integral passives are considered to potentially provide alternatives to current discrete passive components with benefits on system cost, size, functionality and reliability. For embedded capacitor applications, polymer-ceramic nano-composite has been previously investigated as high dielectric constant (K) materials. However, there are some technical barriers to the use of polymer-ceramic composite in organic substrate, e.g., limited dielectric constant value (150) achieved and poor adhesion towards the substrates.The proposer has discovered a novel dielectric material, which is based on polymer-conductive filler composite. The preliminary results have shown an effective dielectric constant as high as over 2000, and nearly the same adhesion as the neat polymer matrix. In order to successfully apply such ultra-high K material to integral capacitor application in next-generation advanced electronic packaging, the proposed project will perform fundamental studies on the following issues:Ultra-high K polymer-conductive filler composite formulation optimization: Continued efforts will be devoted to optimize the formulation for potentially even higher material performance.Modeling of integral capacitor component: This could aid the design and process of integral capacitor components by providing quantitative estimates of the critical material and process parameters.Processability of integral capacitor component using the developed ultra-high K polymer-conductive filler composite: Prototyping of integral capacitor will be constructed from liquid or film composite material. Both rigid and flexible substrates will be used for capacitor development.Reliability performance of the integral capacitors fabricated from the proposed processes:stability/degradation of electrical properties such as dielectric constant as well as adhesion strength, etc. will be monitored against 850C185%RH aging, temperature, humidity and bias (THB) aging, liquid-liquid thermal shock (LLTC), and air-air thermal cycle (AATC), etc.Expected results from the proposed research will enrich the fundamental understanding about the integral capacitor component based on ultra-high K dielectric materials, which will be essential for the realization of integral capacitor application in next-generation micro-electronic packaging.