Fundamental Understanding of Nanofiller Dispersion in Polymer Systems for Electronics Applications

对电子应用聚合物系统中纳米填料分散的基本了解

• 批准号: 0621115
• 负责人: Ching-Ping Wong
• 金额: $ 30万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-08-01 至 2010-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0621115&HistoricalAwards=false
• 关键词: Fundamental; Understanding; Nanofiller; Dispersion; Polymer

The research objective of this award is to study nanodispersion in modified filler systems and composite materials, as they apply to electronic and photonic packaging systems. A variety of novel techniques will be used to integrate dissimilar materials on the nano and microscale and study the rheological effects. The approaches include; (1) Interactions between filler materials and matrix components such as hardener additives will be studied, providing a clear understanding of the relationship between suppression of filler-filler attractive interactions and enhancement of filler-polymer interactions. (2) Investigations will be conducted regarding the interactions between in-situ nanofillers and other composite components including micron-sized fillers and capping agents/hardeners. (3) A variety of multifunctional materials will be employed as self-assembly monolayers (SAMs) to eliminate attractive filler-filler interactions and promote filler-polymer interactions. (4) The rheological properties of the final composite materials will be directly related to suppression of attractive filler-filler interactions through the above approaches. (5) Molecular dynamics modeling will be conducted to better understand filler-filler and nanofiller-polymer interactions on a molecular scale so that nanodispersed composites may be obtained as homogeneous and reproducible samples.If successful, the benefits of this research will include a clear relationship between the data obtained from the modeling and actual production and characterization of final materials, resulting in enabling scientists and engineers from both industry and academia to overcome a variety of problems encountered where composite materials are employed which contain nanofillers. It will also enable the fabrication of highly efficient electrically conductive adhesives and high dielectric constant, low loss dielectric composites as well as a number of composite materials applicable to a variety of electronic packaging systems. This research will not only be useful in the areas of electronic packaging, but as well in any area where nanofiller materials are used. The recent public interests and government initiatives have created many utopias and many high expectations on the results obtained from nanotechnology research. The fundamental understanding of nanodispersion obtained through this work will be essential to make some of these expectations a reality.

该奖项的研究目标是研究改性填料系统和复合材料中的纳米分散，因为它们适用于电子和光子包装系统。各种新技术将被用于在纳米和微米尺度上集成不同的材料并研究流变效应。这些方法包括：（1）将研究填料材料和基质组分（例如硬化剂添加剂）之间的相互作用，从而提供对填料-填料吸引相互作用的抑制和填料-聚合物相互作用的增强之间的关系的清楚理解。(2)调查将进行关于原位纳米填料和其他复合材料组分，包括微米级填料和封端剂/硬化剂之间的相互作用。 (3)各种多功能材料将被用作自组装单分子层（SAM），以消除有吸引力的填料-填料相互作用，并促进填料-聚合物相互作用。 (4)最终复合材料的流变性能将直接与通过上述方法抑制有吸引力的填料-填料相互作用有关。 (5)将进行分子动力学建模，以更好地了解分子尺度上的填料-填料和纳米填料-聚合物相互作用，从而可以获得均匀和可重复的纳米分散复合材料样品。如果成功，这项研究的好处将包括从建模获得的数据与最终材料的实际生产和表征之间的明确关系，使得工业界和学术界的科学家和工程师能够克服在使用含有纳米填料的复合材料时遇到的各种问题。它还将使高效导电粘合剂和高介电常数，低损耗介电复合材料以及适用于各种电子封装系统的复合材料的制造成为可能。这项研究不仅适用于电子封装领域，而且适用于使用纳米填料材料的任何领域。最近的公共利益和政府的倡议创造了许多乌托邦和许多高期望的结果从纳米技术的研究。通过这项工作获得的纳米分散的基本理解将是必不可少的，使这些期望成为现实。