Fundamental Understanding of Anisotropic Conductive Film (ACF) for Flip Chip Packaging

对倒装芯片封装各向异性导电膜 (ACF) 的基本了解

• 批准号: 0217910
• 负责人: Ching-Ping Wong
• 金额: $ 24万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-08-15 至 2006-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0217910&HistoricalAwards=false
• 关键词: Fundamental; Understanding; Anisotropic; Conductive; Film

The goal of this research is to advance the fundamental understanding of the behavior of anisotropic conductive adhesives that could replace lead-containing solders in electronic packaging. Of particular interest is the capability of creating a thin film (ACF) of this material that is stable, with a high current density capacity. Replacing lead-containing solder with alternative interconnect material would significantly impact the manufacturing processes of microelectronic packaging systems, such as flip-chip, ball grid array (BGA), chip scale package (CSP), and surface mount technology (SMT). ACFs are one of the candidates to replace lead-containing solder as interconnect material. Currently, the reliability and performance of these ACF materials are not competitive, and improvements require a better understanding of the interfacial behavior developed in electronics packaging processes. In this project, chemical and physical properties of ACA materials will be studied, and the interfaces in ACF joint will be investigated. Then, the interfaces will be modified to maintain the electrical properties in extreme environment by using corrosion inhibitors and or sacrificial alloys. To improve the current density of ACA, the interfaces will be modified with self-assembling molecular (SAM) wires. The mechanically bonded interface between ACA and chip pad/substrate pad will be modified by SAM, which has been known to be able to deliver high current density. A computational modeling of the processing - property relationship will be developed. During the period of award, the PI will continue to address the integration of research and education with specific activities focused on high school teachers and students from underrepresented groups in local high schools.

这项研究的目的是促进对各向异性导电胶行为的基本了解，这种导电胶可以在电子封装中取代含铅焊料。特别令人感兴趣的是用这种材料制造稳定的、具有高电流密度容量的薄膜(ACF)的能力。用替代互连材料取代含铅焊料将对倒装芯片、球栅阵列(BGA)、芯片规模封装(CSP)和表面安装技术(SMT)等微电子封装系统的制造工艺产生重大影响。ACF是替代含铅焊料作为互连材料的候选材料之一。目前，这些ACF材料的可靠性和性能并不具有竞争力，改进需要更好地了解电子封装工艺中形成的界面行为。本项目将研究ACA材料的化学和物理性能，并对ACF接头中的界面进行研究。然后，通过使用缓蚀剂和/或牺牲合金对界面进行修饰，以保持在极端环境下的电性能。为了提高ACA的电流密度，将使用自组装分子(SAM)线对界面进行修饰。ACA和芯片焊盘/衬底焊盘之间的机械结合界面将通过SAM进行修改，众所周知，SAM能够提供高电流密度。将开发加工-财产关系的计算模型。在获奖期间，国际和平研究所将继续致力于将研究和教育与具体活动结合起来，重点放在高中教师和当地高中代表性不足群体的学生身上。