SBIR Phase I: An Optical Sensor for Semiconductor Back-End Processes

该小型企业创新研究（SBIR）第一期项目建议使用我们的矩阵可寻址激光/探测器阵列芯片开发用于半导体后端过程控制和检测的创新智能光学传感器。该传感器将集成到小间距组件贴片机中，以确保精确的组件贴片，以及组件引线的共平面性，并在贴片前立即检查组件。鉴定在同一平面内的有缺陷或损坏的铅头。附加的检测功能包括焊料凸点的体积和高度、凸点的位置和质量、球的高度和直径、球的共面性和异物。该传感器实际上是一个微型共聚焦扫描激光显微镜，没有任何移动部件。由于没有移动部件或笨重的光学元件，我们能够获得每秒至少60帧的图像速率，并且传感器可以制成非常小的尺寸。这种传感器将使半导体封装制造商提高操作效率，增加产品产量，并增加他们的质量控制。

This Small Business Innovation Research (SBIR) Phase I Project proposes to develop an innovative intelligent optical sensor for semiconductor back-end processes control and inspection by using our matrix-addressable laser/detector array chip. The sensor will be incorporated into the fine pitch component placement machines, to ensure accurate component placement, and co-planarity of component leads and to inspect components immediately before placement. Identification of defective or damage lead tips that lie within the same plane will be. Additional inspection capabilities include solder bump volume and height, bump position and quality, ball height and diameter of ball grit array, ball coplanarity and foreign materials. The sensor actually is a miniature confocal scanning laser microscope without any moving parts. Since there are no moving parts or bulky optics, we are able obtain image rate at least 60 frames per second, and sensor can be made a very small dimension. This sensor will enable semiconductor packaging manufactures to increase operating efficiency, increase product yield, and add to their quality control.