SBIR Phase I: Optimized Microvia Generation Technology for Low-Cost Manufacturing of Electronic Modules

该小型企业创新研究（SBIR）第一阶段项目解决了高密度微通孔的需求，这在各种微电子模块中至关重要，如平板显示器（FPD），多芯片模块（MCM）和印刷电路板（PCB）。随着这些模块变得更快、更紧凑和更有能力，它们的互连密度已经显著增加，并且已经开发了诸如芯片级封装（CSP）和球栅阵列（BGA）之类的新封装技术，以适应所有所需的输入和输出（I/O）连接。这种密集的互连通过在其上构建电子模块的基板层中产生数十万个微通孔来实现。这些微通孔由于其小尺寸和大数量而生产起来也是困难和昂贵的。当前的微孔生成技术没有针对不同制造要求的不同成本考虑进行优化，直写工具解决了小批量需求，而掩模投影系统被设计用于非常高的过孔密度产品。本提案中所述的系统技术提供了若干理想的特征，包括：用于不同通孔密度的高速微孔生成、全微孔图案可编程性、钻高阈值光烧蚀衬底的能力以及可获得的高功率准分子激光器的充分和有效利用。印刷电路板在商业和军事系统中的许多先进技术应用中起着重要作用。 这一项目的结果可能导致大量电子模块的成本降低。

This Small Business Innovation Research (SBIR) Phase I project addresses the requirement of high-density microvias, which are critical in a variety of microelectronic modules, such as Flat-Panel Displays (FPDs), Multi-Chip Modules (MCMs), and Printed Circuit Boards (PCBs). As these modules become ever faster, more compact, and more capable, their density of interconnects has been increasing dramatically and new packaging technologies such as Chip-Scale Packages (CSPs) and Ball-Grid Arrays (BGAs) have been developed to accommodate all the required input and output (I/Os) connections. Such dense interconnects are realized by the generation of hundreds of thousands of microvias in the substrate layers on which the electronic modules are built. These microvias are also both difficult and expensive to produce because of their small sizes and large numbers. Current technologies for microvia generation are not optimized for the varied cost considerations of different manufacturing requirements direct-write tools address low-volume needs, whereas mask projection systems are designed for very high via-density products. The system technology described in this proposal offers several desirable features, including: high-speed microvia generation for different via densities, full microvia pattern programmability, capability to drill high-threshold photo-ablation substrates, and full and efficient utilization of available high-power excimer lasers.A variety of microelectronic modules, such as flat panel displays, multi-chip modules, and printed circuit boards play an important role in numerous advanced technology applications in both commercial and military systems. Results from this project could result in substantial cost reductions in a wide range of electronic modules.