RUI: MRI Acquisition of a Scanning Electron Microscope with Energy Dispersive X-Ray and C-Mode Scanning Acoustic Microscope for a Centralized Laboratory for Imaging and Metrology

这项主要的研究仪器（MRI）补助金是在本科院校研究（RUI）计划的框架内提交的。本次提交的RUI的使命是在罗切斯特理工学院建立成像和计量学中心实验室（CLIM）。仪器要求包括扫描电子显微镜（SEM）与能量色散X射线（EDX）的能力和C模式扫描声学显微镜，这将大大提高RIT的能力，进行有竞争力的本科生research.Intellectual优点：CLIM将建立在RIT的现有优势，在半导体和微系统的制造和封装，以弥合基础研究和产品商业化之间的应用研究差距。拟议的研究仪器的影响将是在建立一个强大的研究基地，为大学生和本科生。研究者愿景的一个主要组成部分是建立本科生研究基础设施，以（i）在本科生的参考期刊上发表文章，（ii）提高RIT对资助机构的可信度，以确保本科生研究的资金，以及（iii）为本科生教育提供上级环境。本提案的项目描述部分列出的该设备所实现的研究活动的各种示例包括：光子光波集成电路制造，晶片键合，微流体封装分析，封装成品率分析，以及绝缘体上硅衬底表征。这些不同的努力有一个共同的需要，以表征（i）材料性能，（ii）工艺开发，和（iii）故障机制。非破坏性结构、化学分析和纳米尺度成像能力是拟议研究计划成功的基础。扫描电子显微镜、能量色散X射线和C模式扫描声学显微镜分别实现了成像、化学分析和结构分析。更广泛的影响：仅在这个项目的第一年，估计通过项目、课堂教学和研究，150名学生将从这个仪器中受益。该设备将立即引入，作为几个类的核心，其中包括：EMCR 201微电子工程导论，EMCR 221（微光刻入门），EMCR 350（ICTechnology），EMCR 564（微光刻系统），EMCR 643（薄膜处理），EMCR 650（IC加工实验室），EMCR 680/690（高级研讨会研究），ITFF 455（表面贴装电子封装简介），ITFF 456（Advanced Concepts in Electronics PackagingLaboratory）和ITFF 457（Electronics PackagingLaboratory）。L. Rommel-MicroelectronicEngineering，A.D. Raisanen-半导体微系统制造实验室，S.M. Ramkumar-制造机械工程技术和包装科学）在材料，工艺和故障表征领域的微系统开发和包装。该项目将促进RIT的器件和封装研究人员之间的合作，以实现下一代高性能微系统。

This major research instrumentation (MRI) grant is submitted within the framework ofthe Research in Undergraduate Institutions (RUI) program. The mission of this RUIsubmission is the establishment of a Centralized Laboratory of Imaging andMetrology (CLIM) at the Rochester Institute of Technology. The instrumentationrequested includes a scanning electron microscope (SEM) with energy dispersive X-ray(EDX) capability and a C-Mode Scanning Acoustic Microscope that would greatlyenhance RIT's ability to conduct competitive undergraduate research.Intellectual Merit: CLIM will build upon RIT's existing strengths in Semiconductor andMicrosystems fabrication and packaging to bridge the applied research gap between basicresearch and product commercialization. The impact of the proposed researchinstrumentation will be in the establishment of a strong research base for investigatorsand undergraduates. A major component of the investigators vision involvesestablishing the undergraduate research infrastructure required to (i) publish in refereedjournals by undergraduates, (ii) enhance RIT's credibility to funding agencies to securefunding for undergraduate research, and (iii) provide a superior environment forundergraduate education.Various examples of research activity enabled by this equipment listed in the ProjectDescription section of this proposal include: photonic lightwave integrated circuitsfabrication, wafer bonding, microfluidic package analysis, packaging yield analysis, andSilicon on Insulator substrate characterization. These diverse efforts share a commonneed to characterize (i) material properties, (ii) process development, and (iii) failuremechanisms. Nondestructive structural, and chemical analysis and nanometer-scaleimaging capability is fundamental to the success of the proposed research initiatives. Thescanning electron microscope, energy dispersive X-ray, and a C-Mode Scanning AcousticMicroscope enable imaging, chemical analysis, and structural analysis, respectively.Broader Impact: In the first year of this program alone, it is estimated that throughprojects, classroom instruction, and research, 150 students will benefit from thisinstrumentation. This equipment will be introduced immediately, as a centerpiece toseveral classes, which include the following: EMCR 201 (Introduction to MicroelectronicEngineering), EMCR 221 (Introduction to Microlithography), EMCR 350 (ICTechnology), EMCR 564 (Microlithography Systems), EMCR 643 (Thin FilmProcessing), EMCR 650 (IC Processing Laboratory), EMCR 680/690 (Senior SeminarResearch), ITFF 455 (Introduction to Surface Mount Electronics Packaging), ITFF 456(Advanced Concepts in Electronics Packaging), and ITFF 457 (Electronics PackagingLaboratory).The research will be conducted by three faculty from RIT (S. L. Rommel-MicroelectronicEngineering, A.D. Raisanen-Semiconductor Microsystems Fabrication Laboratory, andS.M. Ramkumar- Manufacturing Mechanical Engineering Technology and PackagingScience) in the area of materials, process and failure characterization of microsystemsdevelopment and packaging. This project will foster collaboration between device andpackaging researchers at RIT to realize next-generation, high-performance microsystems.