SBIR Phase II: Reactive Multilayer Joining of Metals and Ceramics

该小型企业创新研究第二阶段项目提出开发连接金属和陶瓷部件的技术;这是一种反应连接工艺，使用反应多层箔作为熔化焊料的局部热源。 这些箔是一类新的纳米工程材料，其中可以使用热灯丝或激光在室温下引发自传播放热反应。 通过在两个焊料层和两个组件之间插入多层箔，箔中反应产生的热量熔化焊料，从而粘合组件。 这种新的焊接方法消除了对熔炉或保护气氛的需要，并且通过非常局部的加热，避免了对组件的热损坏。 反应焊接工艺比大多数竞争技术都要快得多，并能产生坚固且具有成本效益的接头。最后一个也是最重要的潜在好处是，与多层箔连接可以使用无铅焊料，因此提供了巨大的环境效益。 该项目可能产生的更广泛影响可能是微电子封装设施。

This Small Business Innovation Research Phase II project proposes to develop technology for joining metallic and ceramic components; this is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders. These foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be initiated at room temperature using a hot filament or laser. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace or protective atmospheres and, with very localized heating, avoids thermal damage to the components. The reactive bonding process is far more rapid than most competing technologies, and results in strong and cost-effective joints. The last and potentially most important benefit is the fact that joining with multilayer foils enables the use of lead free solders and therefore offers tremendous environmental benefits. The broader impacts that could result from this project could be to microelectronic packaging facilities.