Acquisition of Instrumentation for Advanced Materials Characterization

摘要所要求的MRI设备将使三个SDSM&amp；T研究组能够持续增长和发展；即智能结构组、复合材料组和直写技术组。综上所述，SDSM&amp；T研究计划需要一套补充性的仪器，能够对组件进行高度精确的尺寸和分析，并精确确定材料特性。鉴于目前SDSM&amp；T研究工作的重点，预计Nano-XP系统将用于以下研究领域：1)聚合物基复合材料的压痕测试（特别是称为界面的近纤维区域），以及2)传感器/电路耐久性。此外，其他可能的领域还包括搅拌摩擦加工材料的纳米和微观结构表征以及纳米纤维复合材料的表征。一些不断发展的技术提供了令人兴奋的前景，同时也带来了重大的开发挑战。超低重量设计和小型化是两个显著的例子。在这两种情况下，以及许多其他情况下，需要非接触式传感和测量。光学方法是最强大的非接触技术之一。提出的ARAMIS 3D高分辨率散斑干涉仪具有成像表面的自然镜面性质，将与游丝结构和直写多功能集成传感器一起使用。材料加工方法的最新进展，如直接写入制造，开辟了多功能结构元件的可能性。直接写入制造使结构的承载元件能够设计为服务于传感和驱动的附加功能。许多具有严格重量和尺寸限制的通信、医疗、空间和国防应用需要可靠的多功能结构。所要求的动态MEMS光学剖面仪系统是这些应用规模的理想选择。利用这套工具进行教育和培训的机会很大。在这方面，所要求的文书将用于十几门课程，每年总共有400多名学生。此外，SDSM&amp；T拥有一个夏季REU站点，并有第二个REU站点待定，两者都将使用该设备。最后，raidcity拥有蓬勃发展的电信行业，通过与应用电磁学和通信实验室（LAEC）和直接写入实验室的互动，将极大地受益于所要求的设备。

AbstractThe requested MRI equipment will enable the continued growth and development of three SDSM&T research groups; namely, the smart structures group, the composites group and the direct write technology group. Taken together, the SDSM&T research initiatives mentioned above require a complementary suite of instruments capable of highly-accurate dimensioning and profiling of components, and the precise determination of material properties.Given the current focus of SDSM&T research efforts it is envisioned that the Nano-XP system would be utilized in the following research areas: 1) indentation testing of polymer matrix composites (particularly the near fiber region called the interphase), and 2) sensor/ circuitry durability. In addition, other possible areas would include characterization of nano and microstructure of friction stir processed material and characterization of nanofiber composites.Several evolving technologies offer exciting promise, while at the same time providing significant development challenges. Ultra-low weight design and miniaturization are two notable examples. In both of these cases, and many others, non-contact sensing and measurement are required. Optical methods are among the most powerful non-contact techniques. The proposed ARAMIS 3D high-resolution speckle interferometer featuring natural specular nature of the imaged surface will be used with gossamer structures and direct-write, multifunctional integrated sensors.Recent advances in materials processing methods, such as direct-write manufacturing, have opened up the possibility of multifunctional structural elements. Direct-write manufacturing enables load-carrying elements of a structure to be designed to serve the additional functions of sensing and actuation. A number of communications, medical, space, and defense applications with tight weight and size constraints are in need of reliable multifunctional structures. The requested dynamic MEMS optical profiler system is ideal at the scales of these applications.Significant opportunities exist for education and training with this suite of instruments. In this regard, the requested instruments would be utilized in over a dozen courses, totaling more than 400 students/year. In addition, SDSM&T hosts one summer REU site and has a second REU site pending, both of which would utilize this equipment. Finally, Raid City hosts a burgeoning telecommunications industry, which would greatly benefit from the requested equipment through interaction with the laboratory of applied electromagnetics and communications (LAEC) and direct write laboratory.