SBIR Phase II: Non-Contact/Zero-Stress Surface Polishing Process for Copper/Low Dielectric Constant Semiconductors

这个小型企业创新研究（SBIR）二期项目将推进非接触式电抛光工艺的发展，解决纳米芯片集成电路制造所需的Cu/低k互连的非接触式/无应力抛光方法的需求。该技术利用脉冲电解和移动电解液前缘来实现半导体晶圆上铜覆板的完全电化学去除。第二阶段的目标/研究任务包括：1)设计和制造一个非接触式电抛光工艺模块，2)在全尺寸晶圆上演示和优化该工艺，3)开发一个理论模型，定义非接触式电抛光工艺的工艺库，以及4)表征抛光性能及其与所用材料机械性能的关系。在商业上，该计划的预期结果是以包含非接触式电抛光工艺的电化学模块的形式出现的可销售的制造工艺/制造工具。这种产品/工艺技术使其他新兴行业如MEMS和/或NEMS成为可能。总的来说，该项目解决了半导体行业的需求，这是美国商业经济的一个重要方面，将在美国以及世界社会发挥越来越大的作用。此外，该过程最大限度地减少了化学废物和对环境的影响。

This Small Business Innovation Research (SBIR) Phase II project will advance the development of a non-contact electro-polish process, addressing the need for a non-contact/stress-free polishing method for planarization of Cu/low-k interconnects required for the fabrication of nanochip integrated circuits. This technology utilizes pulsed electrolysis and a moving electrolyte front to effect complete electrochemical removal of copper overplate from a semiconductor wafer. The Phase II objectives/research tasks include: 1) design and fabrication of a module for the non-contact electro-polish process, 2) demonstration and optimization of the process on full size wafers, 3) development of a theoretical model defining a process library for the non-contact electro-polish process, and 4) characterization of the polishing performance and relationship to the mechanical properties of the materials used. Commercially, the anticipated results of the program are a marketable manufacturing process/manufacturing tool in the form of an electrochemical module incorporating the non-contact electro-polish process. This product/process technology is enabling to other emerging industries such as MEMS and/or NEMS. In general, the project addresses the needs of the semiconductor industry, which is an important aspect of the US commercial economy and will play an increasing role in the US as well as world society. Furthermore, the process minimizes chemical waste and environmental impact.