SBIR Phase I: Versatile Maskless Patterning Technology For Cost-Effective Fabrication of Microelectronic Packaging Products

该小型企业创新研究(SBIR)研究项目旨在开发一种多分辨率大面积无掩模光刻系统和工艺流程，用于制造电子封装，如集成电路封装、多芯片模块和印刷电路板。这项技术将以单反相机为特色，作为可编程掩模，以及多个投影镜头，可在较大的放大范围内进行成像。可变放大倍率使得能够根据特征大小来设置图像平面中的像素大小--例如，粗略特征(例如，200微米宽的输入/输出焊盘)可以使用比用于对精细特征(例如，20微米宽的互连轨迹)成像的像素大得多的像素大小来成像。通过为给定类型的特征选择最佳像素大小，可以优化系统的图案化速率以实现最高吞吐量。这比其他无掩模光刻技术提供了显著的改进，其他无掩模光刻技术仅限于在小区域上成像，并且仅以单一放大率操作，因此在系统的分辨率或吞吐量方面也受到限制。如果成功，建议的无掩模光刻系统将能够以成本效益的方式制造各种中低容量所需的先进微电子封装模块。它将降低电子元器件的开发和生产成本，适用于需要大量不同类型的非常高性能的电子模块的中低量应用，如便携式电子产品、传感器以及各种通信和控制电路。此外，多分辨率图案化能力对于在同一衬底上制造特征尺寸从微米到数百微米的其他器件将具有吸引力，例如MEMS、MOEMS、光电子电路和微流体。

This Small Business Innovation Research (SBIR) research project aims to develop a multi-resolution large-area maskless lithography system and process flow for fabricating electronic packages, such as integrated circuit packages, multi-chip modules, and printed circuit boards. This technology will feature an SLM as a programmable mask, and multiple projection lenses that perform imaging over a wide magnification range. The variable magnification enables the pixel size in the image plane to be set, depending upon the feature size - for example, coarse features (e.g. 200-um-wide input / output pads) can be imaged using a much larger pixel size than that used to image fine features (e.g. 20-um-wide interconnecting traces). By selecting the optimum pixel size for a given type of feature, the patterning rate of the system can be optimized to achieve the highest throughput. This offers a significant improvement above other maskless lithography techniques, which are limited to imaging over small areas, and which operate at only a single magnification, and are therefore also limited in either the resolution or the throughput of the system. If successful the proposed maskless lithography system will enable cost-effective manufacturing of a variety of advanced microelectronic packaging modules that are required in low to medium volumes. It will reduce development and production costs of electronic components for applications that require low to medium volumes of a large number of different types of very-high-performance electronic modules, such as portable electronics, sensors, and a variety of communication and control circuits. Additionally, the multi-resolution patterning capability would be attractive for fabricating other devices that have feature sizes ranging from microns up to hundreds-of-microns on the same substrate, for example, MEMS, MOEMS, optoelectronic circuits, and microfluidics.