Chip- and wear mechanisms at high speed and high power grinding with planetary kinematic

行星运动双面磨削是一种用于加工具有共面曲面工件的磨削工艺。这种制造过程的运动学导致刀具上的不均匀磨损轮廓，这对可达到的工件表面质量具有负面影响。由于基于工艺参数变化的改进受到特殊工艺运动学的限制，因此可以仅使用具有可变磨削层规格的工具来增强工艺。该项目的主要目标是通过减少磨削工具上的轮廓磨损来优化加工过程。这种优化应通过设计磨损优化的砂轮来实现，这有助于稳定的工艺性能。为了实现这一主要目标，应将第一个提案期创建的分析模型和基于软件的实施扩展到具有可变磨削层规格的刀具。根据软件实施产生的结果，应开发切削速度为vc = 5 m/s的常规加工刀具概念以及切削速度为vc = 25 m/s的前瞻性高速加工刀具概念。

Double face grinding with planetary kinematics is a process, which is used to machine workpieces with coplanar surfaces. The kinematic of this manufacturing process results in uneven wear profiles on the tool, which have a negative impact on the reachable workpiece surface quality. Because the improvement based on a variation of the process parameters is limited by the special process kinematic, it is possible to enhance the process only using tools with variable grinding layer specifications. The main target of this project covers the optimization of the machining process by reducing the profile wear on the grinding tool. This optimization shall be reached by designing wear optimized grinding wheels, which facilitate a stationary process performance. To achieve this main target, the analytical model as well as the software based implementation, which were created in the first proposal period, shall be extended for tools with variable grinding layer specifications. Based on the results generated by the software implementation, a tool concept for conventional machining with cutting speed of vc = 5 m/s as well as a tool concept for forward-looking high speed machining with cutting speed of vc = 25 m/s shall be developed.