SBIR Phase I: High Thermal Conductivity Carbon Composite for Electronics Cooling

这个小型企业创新研究(SBIR)第一阶段项目将展示为电子元器件和电子封装生产创新热管理解决方案的能力。电子产品小型化和功耗增加的双重趋势，使许多电子元器件撞上了“热墙”。需要改进的热管理材料提供高导热系数、低热膨胀系数(CTE)、低密度和低成本。这种方法将超高导热碳纤维与独特的基质相结合，生成了导电率超过1000W/m-K的复合材料。这是通过几天而不是几个月的生产时间实现的。最终结果将是一种创新的、商业上可行的方法来生产性能优于现有材料的热管理材料。这种创新的碳-碳复合材料制造方法将测试生产显著改进的、耐热和机械性能坚固的用于热管理材料的碳-碳复合材料的可行性。改进的热管理材料将用于未来先进系统所需功率输出水平不断提高的电子设备中，如飞机、航天器和超级计算机。将从这些创新中受益的行业包括消费电子、通信系统、高精度制造、卫星和其他航空航天应用。

This Small Business Innovation Research (SBIR) Phase I project will demonstrate the ability to produce an innovative thermal management solution for electronics components and electronics packaging. The dual trends of electronics miniaturization and increased power consumption have caused many electronics components to hit a "thermal wall." Improved thermal management materials are needed that provide high thermal conductivities, low coefficients of thermal expansion (CTE), low density and low cost. This approach combines an ultrahigh thermal conductivity carbon fiber combined with a unique matrix that produces a composite with conductivity in excess of 1000 W/m-K. This is achieved with a production time on the order of days rather than months. The end result will be an innovative, commercially-viable method for producing a thermal management material that outperforms existing materials.This innovative approach for carbon-carbon composite fabrication will test the feasibility of producing dramatically improved, thermally- and mechanically-robust carbon-carbon composites for thermal management materials. Improved thermal management materials will find use in electronic devices with increasing power output levels required for future advanced systems such as aircraft, spacecraft, and supercomputers. Industries that would benefit from these innovations include consumer electronics, communications systems, high precision manufacturing, satellites and other aerospace applications.