STTR Phase I: Atomic Layer Deposition-Enabled Polymer Packaging for Integrating MEMS and Electronics

这个小型企业技术转移（STTR）第一阶段项目将展示一种新的纳米级、保形、原子层沉积（ALD）密封封盖。这种创新的封盖技术将把MEMS和电子集成从双列式封装（DIP）转变为芯片级封装（CSP）、晶圆级封装（WLP）和三维（3-D）封装，这些都是低成本超紧凑系统所必需的。MEMS器件由带有空腔的聚合物层进行机械保护。聚合物加工与现有的微电子元件WLP制造完全兼容。为了满足密封和/或真空要求，将涂层纳米级（25至60纳米）具有疏水表面单层的ald -氧化铝层，以提供全面，保形，无针孔的保护覆盖。该项目将通过使用涂有ald -氧化铝和疏水单层的聚合物结构密封的MEMS封装来证明这一创新概念的可行性。该项目还将通过将微电子非密封式csp转变为密封式csp来演示产品插入过程。该项目将适用于不同制造商生产的各种csp。在商业上，封装被认为是阻碍微机电系统（MEMS）大规模商业化的主要障碍之一。晶圆级密封封盖使MEMS和电子器件集成在双列直插（DIP）封装中。该项目为将ALD应用于MEMS，微电子，光电子和射频（RF）组件和系统的封装创造了新的范例。成功的ALD应用对包装的潜在影响远远超出了提议的密封。

This Small Business Technology Transfer (STTR) Phase I project will demonstrate a new nano-scale, conformal, atomic layer deposition (ALD)-enabled hermetic capping. Such an innovative capping technology will transform MEMS and electronics integration from dual-in-line packages (DIP) into chip-scale packages (CSP), wafer level packages (WLP) and three-dimensional (3-D) packages, which are required for low-costand super-compact systems. MEMS devices are mechanically protected by polymer layers with cavities. Polymer processing is fully compatible with existing WLP manufacturing for microelectronic components. To meet hermetic and/or vacuum requirements, a nano-scale (25 to 60 nm) ALD-alumina layer with a hydrophobic surface monolayer will be coated to provide comprehensive, conformal, pinhole-free protective coverage. This project will demonstrate the feasibility of this innovative concept by using a MEMS package sealed by a polymer structure coated with ALD-alumina and hydrophobic monolayer. The project will also demonstrate a product insertion process by transforming microelectronic non-hermetic CSPs into hermetic ones. The project will be applied to various CSPs produced by different manufactures.Commercially, packaging is recognized as one of the major barriers to the large scale commercialization of Micro-Electro-Mechanical Systems (MEMS). Wafer-level hermetic capping has enabled the integration of MEMS and electronics in dual-in-line (DIP) packages. This project creates a new paradigm to apply ALD for packaging of MEMS, microelectronic, optoelectronic and radio frequency (RF) components and systems. The potential impact of successful ALD applications to packaging extends far beyond the proposed hermetic sealing.