Integrated DC-DC Converter with Substrate-Molded Filter

集成DC-DC转换器和基板模压滤波器(提案编号：摘要：本项目研究了一种用于在半导体IC芯片衬底上制造低损耗、高功率密度电感的与cmos兼容的微加工工艺。利用该基板作为一次性模具，可以制成与基板一样厚(~200-500 mm)的导线和芯层压板。这样形成的衬底模压电感与芯片表面上的CMOS功率电子器件相结合，实现了集成的DC-DC转换器。采用带耦合电感的多相BUCK变流器，降低了对电感的要求，提高了暂态响应。可以实现对称的磁芯几何结构，消除了与磁通不平衡相关的问题。磁场可以被塑造成平行于硅电路，而不是切入硅电路。可以嵌入热插头(电感绕组是其中的一部分)以增强散热。智力价值：前面提到的目标有两种智力价值。第一组包括将第三维度添加到流行的平面电感制造工艺所需的改进。第二组包括实现近乎理想的磁性能和电路性能的机会，而这些性能是分立元件无法实现的。更广泛的影响：该项目的成功将直接惠及手机和笔记本电脑等便携式电子市场，因为拟议的全集成电源转换器体积小、功耗低、成本低。硅胶成型工艺也为单片无线传感器打开了大门。这项研究课题将包括在研究所新开发的研究生课程--先进微系统技术中。联合PIs还将参与旨在促进少数族裔工程专业新生在学业和个人方面取得成功的Step Up计划。

Integrated DC-DC Converter with Substrate-Molded Filter (Proposal No. ECS-0601294)PI: Huikai XieAbstractAbstract: This project investigates a CMOS-compatible micromachining process for building low-loss, high-power density inductors in the substrate of a semiconductor IC chip. By utilizing the substrate as a disposable mold, conductor and core laminates could be made as thick (~200-500mm) as the substrate. The substrate-molded inductors thus formed are combined with the CMOS power electronics on the chip surface to realize an integrated dc-dc converter. A multi-phase buck converter with coupled inductors is employed to alleviate the inductance requirement and to improve transient response. Symmetric core geometries can be realized, eliminating the problems associated with flux imbalance. The magnetic field can be shaped to parallel to, rather than cutting into, the silicon circuitry. Thermal plugs (the inductor windings being some of them) can be embedded to enhance heat removal. Intellectual Merit: Two sets of intellectual merits can be identified with the aforementioned goals. The first set comprises the advances needed to add the third dimension to the popular planar inductor fabrication processes. The second set comprises the opportunities to realize near-ideal magnetic and circuit performance that are not realizable with discrete components. Broader Impact: The success of this project will directly benefit portable electronics markets such as cell phones and laptops because of the small size, low power loss and low cost of the proposed fully integrated power converter. The silicon molding process opens the door for monolithic wireless sensors too. This research topic will be included in a graduate course, Advanced Microsystem Technology, newly developed by the PI. The co-PIs will also participate in the STEP-UP program designed to promote academic and personal success among minority freshman engineering students.