SBIR Phase I: CMP Slurry Monitor

这个SBIR一期项目是开发一种化学机械抛光（CMP）浆料监测器，作为一种完全在线的、实时的、使用点的仪器，它将检测和分散集成电路制造中使用的纳米浆料中的大团块。监控器不仅会检测到引起划痕的凝聚体，还会试图破坏它们。浆料监测器的成功开发将提高半导体行业的产量并降低成本。诱导微空化原理在液体/颗粒处理中有广泛的应用。通过检测和破坏团块，可以改进工艺和产品。

This SBIR Phase I project is to develop a Chemical Mechanical Polishing (CMP) Slurry Monitor as a fully in-line, real-time, point of use instrument that will detect and disperse large agglomerates in the nanofine slurries used in IC manufacture. The monitor will not only detect scratch inducing agglomerates but will also attempt to destroy them.Successful development of the slurry monitor will improve yields and decrease costs for the semiconductor industry. The principles of induced microcavitation may find wide applications in liquid/particle processing. By detecting and destroying agglomerates improved processes and products will be enabled.