SHF: Small: Reducing the Cost of Computation in CMPs

“该奖项是根据2009年美国复苏和再投资法案（公法111-5）资助的。“计算机处理器行业已全面进入多核时代，以实现性能的持续扩展，但由于温度和热梯度的升高，能耗和冷却成本也随之增加。 该提案描述了三个主要的研究方向，以多种方式解决这些成本：（1）新的建模和仿真工具：我们将集成性能，功耗，温度，可靠性和冷却评估，以便设计人员能够分析设计选择和运行时间决策在很长一段时间内的影响。(2)线程调度策略：我们将确定和演示电源和热调度机制，保持性能，降低总能耗，消除或减少热点，但也最大限度地提高处理器寿命。这些策略将使用来自热传感器和性能计数器的数据来主动推动管理决策。(3)新的冷却策略：我们的目标是创建热管理和冷却控制算法，协同工作，以降低整体能耗。拟议的研究形成了在多核处理器领域的发现和学习的基础，更普遍的是，系统设计和管理。 研究生和本科生将参与拟议研究的各个部分，并帮助将这项工作与其他NSF赞助的项目联系起来。研究成果，工具和课程材料的开发将自由和容易地分发给广大工程界。

"This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5)." Computer processor industry has moved fully into the multi-core era to enable continual scaling of performance, but at the cost of increased energy consumption and increased cooling costs due to higher temperatures and thermal gradients. This proposal describes three major research thrusts that address these costs in multiple ways: (1) New modeling and simulation tools: We will integrate performance, power, temperature, reliability and cooling estimation, so that the designers will be able to analyze the impact of design choices and runtime decisions over significant time spans. (2) Runtime thread scheduling policies: We will identify and demonstrate power and thermal scheduling mechanisms that maintain performance, reduce the total energy consumption, and eliminate or reduce hot spots, but also maximize processor lifetime. The policies will use the data from thermal sensors and performance counters to proactively drive the management decisions. (3) New cooling strategies: Our goal is to create thermal management and cooling control algorithms that work in tandem to reduce the overall energy consumption.The proposed research forms the basis for discovery and learning in the areas of multi core processors, and, more generally, system design and management. Graduate and undergraduate students will be involved in various parts of the proposed research and help in connecting this work with other NSF sponsored projects. The results of research, tools and coursework materials developed will be freely and easily distributed to engineering community at large.