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EAGER: Transmission Welding and Single-Step Channeling of Transparent Materials by Ultrafast Laser

EAGER: Transmission Welding and Single-Step Channeling of Transparent Materials by Ultrafast Laser
EAGER:超快激光透明材料的透射焊接和单步通道
批准号:
0936171
负责人:
Y Lawrence Yao
金额:
$23.03万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2009
资助国家:
美国
项目状态:
已结题
起止时间:
2009-07-01 至 2011-12-31

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中文摘要
翻译
这一早期概念探索性研究奖助金(AGER)项目的目标是显著提高超快激光传输焊接和玻璃等透明介质中的单步沟道工艺的知识水平。具体地说,目的是(A)深入了解与生成的焊缝和通道的形态相关的潜在物理现象以及可靠的预测能力;以及(B)结合预测能力利用表征技术来阐明玻璃环结构的重新排列与机械性能变化的关系及其对焊缝可靠性的影响。虽然超快激光在透明介质内部的非线性吸收是已知的,但如何精确地控制和预测产生的特征的形貌是一个巨大的挑战。同样重要的是了解和预测激光处理如何影响焊缝周围的机械性能,例如断裂韧性,并探索其强化效果。飞秒激光诱导下折环结构的结构重排与玻璃致密化和力学性能变化有关。该项目的成功将为生命科学行业提供新的设计机会。单步导槽使整体式微流控芯片实验室设计具有更高的紧凑性和耐压性。变速箱焊接使包含热敏感元件的可植入微系统的新型胶囊设计成为可能。液晶显示器和等离子显示器等平板显示器应用和有机发光二极管等照明应用将具有更可靠的密封工艺,从而延长产品寿命和提高质量。将积极招聘和深思熟虑地培养合格和任职人数不足的学生,以帮助培训这些关键和新兴领域急需的人力资源。研究成果将被纳入研究生水平的课程并广泛传播。
英文摘要
The objective of this EArly-Concept Grants for Exploratory Research (EAGER) project is to significantly advance the state of knowledge in ul-trafast laser enabled transmission welding and single-step channeling processes in transparent dielectrics such as glasses. Specifically, the aims are to (a) develop a deep understanding of the underlying physical phenomena associated with morphology of generated welds and channels as well as reliable predictive capabilities; and (b) utilize characterization techniques in conjunction with the predictive capabilities to elucidate the relationship of the rearrangement of glass ring structures to the change in mechanical prop-erties as well as its implications on reliability of welds. While the non-linear absorption of ultrafast laser in interior of transparent dielectrics is known, how to precisely control and predict the morphology of generated features presents significant challenges. Equally important is the understanding and prediction how the laser process affects mechanical properties, for example, fracture toughness, around welds and to explore its strengthening effects. Femtosecond laser induced structural rearrangement to lower-fold ring struc-tures are linked to glass densification and mechanical property changes. The success of this project will provide new design opportunities in life sciences industry. Single-step-channeling enables monolithic microfluidic lab-on-a-chip designs with a new level of compactness and pressure resistance. Transmission welding enables new capsule designs of implantable micro-systems containing thermally sensitive components. Flat panel display applications such as liquid crystal displays and plasma displays and lighting applications such as organic light emitting diodes will have a more reliable sealing process and thus longer product life and improved quality. Actively recruiting and thoughtfully nurturing qualified and underrepresented students in particular will be carried out to help train much needed human resources in these critical and emerging fields. The research results will be incorporated into a graduate level course and widely disseminated.
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