Design and Modeling Framework for Managing Variability in Silicon Interposers for 3D Integration

该奖项的研究目标是开发一种设计框架，通过考虑整个系统的局部和全局变化，实现以硅通孔（tsv）为重点的2.5D和3D集成微系统的多物理场变异性建模。利用这一框架，将开发方法，在热-电-机械多物理域进行局部参数优化，以最大限度地减少可变性和最大限度地提高性能。由于所涉及的结构的多尺度和制造的变化，对三个领域之间的多物理场相互作用进行建模的难度很大。此外，使用微流体等技术来冷却此类系统，使需要建模的领域进一步复杂化。交付成果包括开发一个建模框架，用于跨2.5D/3D子系统或包含tsv的系统同时分析热、电和力学方程，以及一种方法，用于捕获域之间的相互作用，并在关键区域进行参数化，以实现热、电和机械行为的跨域优化。如果成功，这项研究将产生一个设计和建模框架，可以解决半导体行业在设计3D集成系统时面临的问题。这项研究的结果将被传播到设计界，并用于开发3D系统集成的课程材料，以使本科生和研究生受益。高中生和教师也将通过该奖项接受教育，提高他们对半导体和电子工业小型化电子系统所面临的问题和挑战的认识。

The research objective of this award is to develop a design framework that enables the modeling of multi-physics variability in 2.5D and 3D integrated micro-systems with a focus on silicon vias (TSVs), by accounting for both local and global variations across the system. Using this framework, methods will be developed for localized parametric optimization across the thermal-electrical-mechanical multi-physics domains for minimizing variability and maximizing performance. The difficulty in modeling these multi-physics interactions between the three domains is complicated due to the multi-scale dimensions of the structures involved and manufacturing variations. In addition, use of technologies such as micro-fluidics for cooling such systems further complicates the domains that need to be modeled. The deliverables include the development of a modeling framework for simultaneous analysis of the thermal, electrical and mechanical equations across a 2.5D/3D sub-system or system containing TSVs, and a means to enable the capture of the interaction between the domains and parameterization in critical areas for the cross domain optimization of the thermal, electrical and mechanical behavior. If successful, this research will lead to a design and modeling framework that could address the problems being faced by the semiconductor industry for the design of 3D integrated systems. The results of this research will be disseminated to the design community and also used to develop curriculum material for 3D system integration to benefit both undergraduate and graduate students. High school students and teachers will also be educated through this award by creating awareness amongst them on the issues and challenges being faced by the semiconductor and electronics industry for miniaturizing electronic systems.