Inter-University Workshop on Next Generation Package Design

下一代包装设计大学间研讨会

• 批准号: 9711762
• 负责人: Madhavan Swaminathan
• 金额: $ 7万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-06-15 至 2000-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9711762&HistoricalAwards=false
• 关键词: Inter; University; Workshop; Next; Generation

9711762 Swaminathan This award is for support for the Inter-University Workshop on Next Generation Package Design. The workshop will result in the identification of: 1) key technical barriers, 2) current university based research status, and 3) major voids that need to be addressed. The results will be published in proceedings and workshop notes. This knowledge gained from this workshop will enable researchers to concentrate research on major technical issues, leverage synergistic research, and identify collaborative activities. The workshop will open to the electronics industry (users of design methods/tools), software industry (developers of design tools), and government organizations to facilitate an open exchange of ideas. The collaboration plan is to use the workshop as a forum to leverage, establish synergy, and strategically coordinate university based research activities. The workshop will help establish partnerships among universities for research and industry for commercialization. These partnerships will then approach key companies and government organizations for support and assistance where needed. The second year workshop will highlight collaboration progress. The result will be a more comprehensive and coordinated plan to address key technical and competitiveness issues associated with next generation package design. A total of five sessions discussing key design issues is planned along with a panel discussion. Engineering Research Centers normally involve studies in research that involves proof-of- concept testbeds. This facility will be the first of its kind in an Engineering Research Center and in a university where the students will have the potential to go beyond proof-of-concept testbeds, to prototype production through a systems-level engineering project. This extends their education from study of concepts to include the effects of manufacturing constraints on their results.

小行星9711762 该奖项是为了支持下一代包装设计大学间研讨会。 研讨会将确定：1）关键的技术障碍，2）当前大学的研究现状，以及3）需要解决的主要空白。 结果将在会议记录和讲习班说明中公布。 从这次研讨会获得的知识将使研究人员能够集中研究主要的技术问题，利用协同研究，并确定合作活动。 研讨会将开放给电子行业（设计方法/工具的用户），软件行业（设计工具的开发人员）和政府组织，以促进开放的思想交流。 合作计划是利用研讨会作为一个论坛，以杠杆作用，建立协同作用，并战略性地协调大学为基础的研究活动。 该讲习班将帮助大学之间建立研究伙伴关系，并帮助工业界建立商业化伙伴关系。 这些伙伴关系将在需要时与主要公司和政府组织接触，以获得支持和援助。 第二年的研讨会将突出合作进展。 其结果将是一个更全面和协调的计划，以解决与下一代封装设计相关的关键技术和竞争力问题。 计划沿着一次小组讨论，共举行五次会议，讨论关键设计问题。 工程研究中心通常涉及涉及概念验证试验台的研究。 该设施将是工程研究中心和大学中的第一个此类设施，学生将有可能超越概念验证试验台，通过系统级工程项目进行原型生产。 这将他们的教育从概念研究扩展到包括制造限制对其结果的影响。