SBIR Phase I: A Profilometry/Sidewall Imaging Tool for High Aspect Ratio Microstructures

这个小型企业创新研究第一阶段项目致力于一种新型的计量传感器，以实现对高纵横比结构的先进多维测量。目前提出的工作集中在一种新的方法上，使用纳米针来创建新的纳米计量传感器，并扩展我们现有的特征测量能力，以包括从75微米到500纳米宽和50到100微米深的高纵横比微结构的侧壁成像。在包括MEMS、医疗植入物等在内的各种产品和行业中，元件的小型化程度不断提高，推动了对新的、功能更强大的微尺度测量的需求。现有的测量技术无法满足这些行业当前和未来的微观计量需求。具体地说，他们面临着几个严重的缺陷：1)他们测量深而窄的特征和侧壁的能力有限；2)需要多种测量工具来测量形状、波纹度和粗糙度；3)完全无法执行三维测量。这项SBIR研究建议大幅缩小基于驻波传感器的基于共振的侧壁检测工具的尺寸。这项工作将解决可用于纳米和微米计量的非线性谐振器的建模，以及一种新的纳米自动化工艺，以增强MEMS行业中用于计量工具的传感器的传感特性。第二阶段计划作为扩展阶段，开发批量流程，与MEMS代工厂的早期采用者合作，并通过我们的工业合作伙伴建造一台计量检验机。该项目的更广泛的影响/商业潜力是提供高精度的计量工具，以满足MEMS和微制造生产环境中日益增长的挑战。微型制造方面的科学进步正在进行中，这将极大地提高我们在医疗器械、流体和新一代三维电子设备等方面的生活质量。然而，如果质量控制工具没有下一步的进步，能够在纳米级提供可追踪的多维测量结果，这一进展将被显著扼杀。能够探测内部特征、测量侧壁和3D结构的工具将使包括MEMS在内的整个行业在制造过程中具有更好的成品率、更好的洞察力和更低的成本。拟议的研究旨在开发这样一种工具并将其商业化。

This Small Business Innovation Research Phase I project addresses a novel metrology sensor to enable advanced multi-dimensional measurements of high aspect ratio structures. The current proposed work focuses on a novel methodology using nanoneedles to create a new nano-metrology sensor and extend our current feature measurement capability to include sidewall imaging of high aspect ratio microstructures ranging from 75 micrometer down to 500 nm wide and 50 to 100 micrometer deep. The demand for new and more capable microscale measurements has been driven by the increasing miniaturization of components in a wide range of products and industries including MEMS, medical implants, and many more. Existing measurement technologies are unable to meet the current and future micro-metrology needs in these industries. Specifically, they suffer several critical deficiencies 1) limited in their ability to measure deep narrow features and sidewalls 2) multiple measurement tools are required to measure form, waviness, and roughness and 3) complete inability to perform three dimensional measurements. This SBIR research proposes to dramatically reduce the size of resonance based sidewall inspection tools based around standing wave sensors. This work will address modeling of nonlinear resonators that are scaleable for nano and micro metrology and a novel nanoautomation process to enhance sensing characteristics for sensors targeted for metrology tools in the MEMS industry. The phase II program is planned as a build out phase to develop batch processes, work with early adopators in MEMS foundaries and construct a metrology inspection machine through our industrial partner. The broader impact/commercial potential of this project is to provide high precision metrology tools to meet increasing challenges in the MEMS and micromanufacturing production environments. Scientific advances are underway in microscale manufacturing that will greatly improve our quality of life in medical devices, fluidics, and the new generation of three dimensional electronics to name a few. However, the progress will be significantly stifled without the next advancement in quality control tools that are capable of providing traceable multi-dimensional measurements at a nanoscale level. A tool that is capable of probing inside features, measuring sidewalls and 3D structures will enable the entire industry including MEMS to have better yield, better insight and lower costs in the manufacturing process. The proposed research aims to develop and commercialize such a tool.