Planning Grant: I/UCRC for Nexys: Next Generation Electronic System Design

规划资助：下一代电子系统设计（NEXYS） 1160997卡内基梅隆大学；戴安娜·马库莱斯库1160980宾夕法尼亚州立大学；Vijay Narayanan 1161008匹兹堡大学；这项计划拨款提案的目标是一个关于下一代电子系统设计的新项目（称为Nexys：下一代电子系统设计），该项目由卡内基梅隆大学（牵头机构）与宾夕法尼亚州立大学和匹兹堡大学合作开展。参与的大学提出了一个框架，将允许学术界和产业界之间的无缝沟通渠道，并将推动半导体和电子设计自动化领域的创新。建议的研究重点反映了pi的专业知识，包括：系统级功率/热/可持续性建模，分析和优化；系统级可靠性、鲁棒性和系统寿命建模和优化，以及测试和诊断；片上通信结构；制造过程或系统参数可变性对架构和系统级别的影响和缓解；三维集成;先进的存储器设计，包括相变和磁阻RAM。此外，该计划将包括针对不同应用平台的几个交叉研究主题：嵌入式、高性能、网络物理、可重构计算和fpga。拟议的框架将在参与的学术和工业机构之间提供直接的思想交流，以及学生/研究人员的交流，同时还将建立一个多样化的参与者群体，对本科/研究生教育或其他教育产生深远影响。拟议中的中心计划使技术从学术方面快速转移到工业合作伙伴，并建立一个稳定的研究生管道，从事与工业相关的项目，并获得工业的直接反馈。这三所大学都致力于一个强大的教育和咨询项目，但多样性将在他们的努力中明确解决。

Planning Grant: Next Generation Electronic System Design (NEXYS) 1160997 Carnegie Mellon University; Diana Marculescu 1160980 Penn State University; Vijay Narayanan 1161008 University of Pittsburgh; Alex Jones This planning grant proposal targets a new program on next generation electronic system design (dubbed Nexys: Next Generation Electronic System Design), based at Carnegie Mellon University (lead institution), in collaboration with Pennsylvania State University and the University of Pittsburg. The participating universities propose a framework that will allow a seamless communication channel between academic and industries, and will enable innovation in the semiconductor and electronic design automation field. The proposed research thrusts reflect the expertise of the PIs and include: system-level power/thermal/sustainability modeling, analysis and optimization; system-level reliability, robustness, and system lifetime modeling and optimization, as well as test and diagnosis; on-chip communication fabrics; manufacturing process or system parameter variability impact and mitigation at architecture and system level; 3D integration; advanced memory design, including phase-change and magnetoresitive RAM. In addition, the proposed program will include several cross-cutting research themes targeting different application platforms: embedded, high-performance, cyber-physical, reconfigurable computing and FPGAs. The proposed framework will provide a direct flow of ideas among participating academic and industrial institutions, as well as student/researcher exchanges, while also building a diverse body of participants, with deep implications in undergraduate/graduate education or beyond. The proposed center plans to enable fast transfer of technology from the academic side to industrial partners, and a steady pipeline of graduate students working on industrial-relevant project with direct feedback from industry. All three institutions are committed to a strong educational and advising program, but diversity will be addressed explicitly in their efforts.