Planning Grant: I/UCRC for Nexys: Next Generation Electronic System Design

规划补助金：下一代电子系统设计(NEXYS)1160997卡内基梅隆大学；戴安娜Marculescu 1160980宾夕法尼亚州立大学；Vijay Narayanan 1161008匹兹堡大学；Alex Jones这项规划拨款提案针对的是卡内基梅隆大学(牵头机构)与宾夕法尼亚州立大学和匹兹堡大学合作的下一代电子系统设计新项目(名为Nexys：下一代电子系统设计)。参与的大学提出了一个框架，允许学术和行业之间的无缝沟通渠道，并将使半导体和电子设计自动化领域的创新成为可能。拟议的研究重点反映了绩效指标的专门知识，并包括：系统级功率/热/可持续性建模、分析和优化；系统级可靠性、健壮性、系统寿命建模和优化以及测试和诊断；芯片上通信结构；制造工艺或系统参数在体系结构和系统级的影响和缓解；3D集成；高级存储器设计，包括相变和磁阻RAM。此外，拟议的方案将包括针对不同应用平台的几个交叉研究主题：嵌入式、高性能、网络物理、可重构计算和现场可编程门阵列。拟议的框架将在参与的学术和工业机构之间提供直接的思想流动，以及学生/研究人员交流，同时还将建立一个多样化的参与者群体，对本科/研究生教育或以后产生深远影响。拟建的中心计划使技术从学术方面快速转移到行业合作伙伴手中，并建立稳定的研究生管道，从事与工业相关的项目，并获得行业的直接反馈。这三个机构都致力于一个强有力的教育和咨询计划，但他们的努力将明确解决多样性问题。

Planning Grant: Next Generation Electronic System Design (NEXYS) 1160997 Carnegie Mellon University; Diana Marculescu 1160980 Penn State University; Vijay Narayanan 1161008 University of Pittsburgh; Alex Jones This planning grant proposal targets a new program on next generation electronic system design (dubbed Nexys: Next Generation Electronic System Design), based at Carnegie Mellon University (lead institution), in collaboration with Pennsylvania State University and the University of Pittsburg. The participating universities propose a framework that will allow a seamless communication channel between academic and industries, and will enable innovation in the semiconductor and electronic design automation field. The proposed research thrusts reflect the expertise of the PIs and include: system-level power/thermal/sustainability modeling, analysis and optimization; system-level reliability, robustness, and system lifetime modeling and optimization, as well as test and diagnosis; on-chip communication fabrics; manufacturing process or system parameter variability impact and mitigation at architecture and system level; 3D integration; advanced memory design, including phase-change and magnetoresitive RAM. In addition, the proposed program will include several cross-cutting research themes targeting different application platforms: embedded, high-performance, cyber-physical, reconfigurable computing and FPGAs. The proposed framework will provide a direct flow of ideas among participating academic and industrial institutions, as well as student/researcher exchanges, while also building a diverse body of participants, with deep implications in undergraduate/graduate education or beyond. The proposed center plans to enable fast transfer of technology from the academic side to industrial partners, and a steady pipeline of graduate students working on industrial-relevant project with direct feedback from industry. All three institutions are committed to a strong educational and advising program, but diversity will be addressed explicitly in their efforts.