CSR: Small: Exploiting 3D Integration for Power Management in Embedded Processors
CSR: Small: Exploiting 3D Integration for Power Management in Embedded Processors
批准号:
1218745
负责人:
Saibal Mukhopadhyay
金额:
$45.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2012
资助国家:
美国
项目状态:
已结题
起止时间:
2012-09-01 至 2017-08-31
中文摘要
片上系统的复杂性和功率需求预计在未来几年将会增长,这使得低功耗设计和低损耗功率传输对于未来嵌入式系统的能效至关重要。考虑到功率传输和低功耗设计之间的相互依赖关系,本研究的目的是探索在嵌入式处理器中进行有效的电源管理的创新技术和方法。正在开发一种系统平台,其中电源管理单元由电源传输电路和电源控制电路组成,采用3D异质集成方式与处理器垂直集成。采用一种集成方法,将3D电源管理层中的电路创新与处理器电源的在线控制相结合,以最大限度地提高系统的电源效率,同时确保可靠的操作。嵌入式系统在现代社会的各种应用中无处不在,其中包括医疗系统、手持设备、航空系统、网络和安全等。电源管理通常被认为是未来嵌入式系统最关键的问题。3D电源管理方法可以为嵌入式系统中的电源问题提供变革性的解决方案,消除阻碍其电源性能重大进步的障碍,放松封装限制,并减少系统占用空间。研究成果通过会议和期刊出版物、短期课程、教程和项目网站传播,并整合到研究生和本科生的VLSI课程中。该项目与暑期本科工程/科学研究(SURE)和促进工程与科学学术生涯(FACES)计划合作,以增加本科生和代表不足的学生对计算机系统研究的参与。
英文摘要
The complexity and power demands for System-on-Chips are projected to grow in coming years, making low-power design and low-loss power delivery critical for power-efficiency of future embedded systems. The objective of the proposed research is to explore innovative technology and methodologies for effective power management in embedded processors considering the interdependence between power delivery and low-power design. A system platform is being developed in which the power management unit, consisting of the power delivery and the power control circuits, is integrated vertically with a processor using 3D heterogeneous integration. An integrated approach is pursued that couples the circuit innovations in the 3D power management tier with the on-line control of the processor power to maximize the power-efficiency of the system while ensuring reliable operation. Embedded systems are ubiquitous in modern society in various applications including medical systems, handheld devices, aviation systems, networking, and security, to name a few. Power management is often considered to be the most critical problem for future embedded systems. The 3D approach to power management can enable transformative solutions to the power problem in embedded systems, removing barriers to major advancements in their power-performance, relaxing packaging constraints, and reducing system footprint. The research results are disseminated through conference and journal publications, short-courses, tutorials, and project website and integrated in the graduate and undergraduate VLSI courses. The project is engaged with the Summer Undergraduate Research in Engineering/Science (SURE) and Facilitating Academic Careers in Engineering and Science (FACES) programs to increase participation of undergraduate and under-represented students in computer systems research.
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批准号:2328962
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项目类别:Continuing Grant
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资助金额:$129.0万
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财政年份:2023
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负责人:Saibal Mukhopadhyay
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财政年份:2017
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CAREER: 3D Heterogeneous Integration for Power Reduction in Embedded Systems: Application to Wireless Image Sensing and Transport
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