High Density Broadband Signal Interconnects with Embedded Patterned Substrate Layers

项目摘要1231368智力优点：该项目的目标是开发新的封装互连与嵌入式图案基板层，使工程师能够操纵色散，阻抗，和高阶模式在高密度和高数据速率通道。创新之处在于在传输线中的接地层和信号层之间添加了具有亚波长结构的图案化层。具有这种结构的互连将使用公知的封装材料并且没有通孔来实现设计灵活性和上级性能。另一个独特的方面是图案化结构的设计，该图案化结构是非周期性的，因为图案密度（并且因此阻抗）沿着线路沿着变化。这些线将沿传输线的长度呈现沿着渐变的介电常数，这可以通过补偿传播方向上的延迟来减小色散。能力？工程特性阻抗为具有适当场和阻抗匹配的高性能互连创造了全新的可能性。该研究将包括全波模拟，并通过原型结构的测量进行验证。其目标是增加约10 GHz的信号带宽，并减少至少25%的信号损失比目前的有线互连。 该研究项目基于使用众所周知的介电材料来改变传输线的电气特性，并填补了现有方法的技术空白。这项工作的理想结果是实现非均匀的介电常数，这在实际中还没有实现。更广泛的影响：这项工作将通过提供一种新的互连方法为美国工业带来价值。我们希望实现独特的互连解决方案，该解决方案具有低色散的低介电常数和使用可靠制造工艺的尺寸收缩方面的高介电常数。 在这项工作中开发的框架将适用于各种各样的传输线。该项目的结果，包括模拟和实验的比较，将通过论文和通过网站提供结果向科学界广泛传播。 该项目包括培养一支了解信号完整性和可制造性设计等问题的员工队伍。电子封装原理课程将转换为在线形式。 将开发视频制作的虚拟实地考察，让学生进入模拟和电路制造实验室，并在大一工程课程中提供。这些材料还将用于招收高素质的高中生，参加大学学分课程。

Project Abstract 1231368Intellectual Merit: The objective of this project is develop new packaging interconnections with embedded patterned substrate layers that allow engineers to manipulate dispersion, impedance, and higher order modes in high density and high data rate channels. The innovation is the addition of a patterned layer with sub-wavelength structures that sits between the ground and signal layers in a transmission line. Interconnects with such structures will achieve design flexibility and superior performance using well-known packaging materials and without vias. Another unique aspect is the design of patterned structures that are non-periodic since the pattern density (and thus impedance) change along the line. These lines will exhibit a graded permittivity along the length of a transmission line which can reduce dispersion by compensating for delay in the direction of propagation. The ability to ?engineer characteristic impedance? creates entirely new possibilities for high performance interconnects with appropriate field and impedance match. The research will include full-wave simulations that are verified by measurements on prototype structures. The goal is an increase is approximately 10GHz in signal bandwidth and a reduction of at least 25% of signal loss over present-day wired interconnects. The research project is based on transforming the electrical properties of transmission lines using well-known dielectric materials and fills in technology gaps of present methods. The dream outcome of this work is to realize a non-homogeneous permittivity, which has not been practically realized. Broader Impacts: This work will bring value to US industry by providing a new approach to interconnects. We hope to achieve unique interconnect solutions that have features of both low permittivity for low dispersion and high-permittivty in terms of size shrinkage that uses reliable manufacturing processes. The framework developed in this work will be applicable to a wide variety of transmission lines. Results of the project including comparisons of simulations and experiments will be widely disseminated to the scientific community by papers and by providing results via a website. The project includes development of a workforce aware in issues such as signal integrity and design for manufacturability. A course in electronic packaging principles will be converted to an on-line format. Video-produced virtual field trips that take students into the simulation and circuit fabrication laboratories will be developed and offered in freshman engineering courses. These materials will also be used in recruiting highly qualified high school students taking courses for university credit.