Characterization of High-Density Interconnect Structures for High Speed Digital and Wireless Communications Applica- tions

高速数字和无线通信应用的高密度互连结构的表征

• 批准号: 9710568
• 负责人: Kathleen Melde
• 金额: $ 5.94万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-09-01 至 1999-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9710568&HistoricalAwards=false
• 关键词: Characterization; Density; Interconnect; Structures; Speed

9710568 Virga Research Activities - This research is directed at characterizing the performance behavior of high-density interconnect and distribution structures employed in compact high-speed digital and wireless communications circuit packages, The primary focus is to develop advanced measurement-based characterization techniques for complex, three-dimensional (3-D), multi-layer, interconnect structures. Examples of complex interconnects include non-ideal (non-circular and non solid) multi-layer vias, many closely-spaced vertical conductors, fuzz buttons, and transitions between vertical and horizontal conductors. Embedded interconnects are typically inaccessible in a package, thus there are currently no means to directly measure individual structures. Since advanced high-density circuit packages incorporate very mixed-signal technologies, such as digital, analog, and RF signal conductor traces, hybrid measurement methods must be developed to accurately identify interconnect performance. High payoff is achieved when measurement results are linked with advanced packaging design simulation tools. The coordination of computer-aided design (CAD) and computer aided test (CAT) results in improved first past design success and enables the rapid development of novel, low-cost advanced packaging technologies. The research will involve both time-domain and frequency-domain measurement techniques. The work will entail a balance between microwave-based (scattering parameters) and microelectronics-based (unique voltages and currents) methodologies. The specific objectives of this research are develop advanced measurement methodologies based upon a hybrid of time-domain and frequency-domain approaches as well as microwave and microelectronics based approaches for three dimensional embedded interconnect structures employed in high-speed digital and wireless circuits, develop links between measured characteristics and circuit analysis and design simulation tools, characterize a few complex inter connect structures and make test results available to code developers to be used as benchmarks for comparisons with high performance simulation tools. The research will first involve defining various advanced 3-D interconnects for high-speed digital, RF, microwave, and MEMS (Micro-Electromechanical Systems) packaging. The theoretical background and implementation details of current measurement techniques for calibration and interconnect de-embedding will be evaluated. New measurement techniques that overcome the fundamental limitations of existing methods will be developed. Such methods will be developed from hybridizing time-domain & frequency-domain techniques. The new methods will be used to provide accurate calibrations that do not rely on unrealistic packaging assumptions. Interconnect de-embedding and statistical-based interconnect characterization will also be developed. Several structures will be fabricated in order to provide validations to the new approaches. The last part of the research will be geared toward creating links between measured interconnect characteristics and design simulation tools. One novel approach to use in these links is the space-mapping technique that has been successfully used in the simulation-based optimization of some microwave circuits. ***

9710568 VERGA研究活动-这项研究旨在描述紧凑型高速数字和无线通信电路封装中使用的高密度互连和分布结构的性能行为，主要重点是为复杂的三维(3-D)多层互连结构开发先进的基于测量的表征技术。复杂互连的例子包括非理想(非圆形和非实心)多层过孔、许多紧密间隔的垂直导体、毛茸茸的按钮以及垂直和水平导体之间的过渡。嵌入的互连在封装中通常是不可访问的，因此目前没有直接测量单个结构的手段。由于先进的高密度电路封装结合了非常混合的信号技术，如数字、模拟和RF信号导线轨迹，因此必须开发混合测量方法来准确识别互连性能。当测量结果与先进的包装设计模拟工具相关联时，可以实现高回报。计算机辅助设计(CAD)和计算机辅助测试(CAT)的协调，提高了首次设计的成功率，并使新的、低成本的先进包装技术得以快速发展。这项研究将同时涉及时域和频域测量技术。这项工作需要在基于微波的(散射参数)和基于微电子的(独特的电压和电流)方法之间取得平衡。这项研究的具体目标是为高速数字和无线电路中使用的三维嵌入式互连结构开发基于时域和频域方法以及基于微波和微电子学的方法的先进测量方法，在测量特性和电路分析和设计仿真工具之间建立联系，表征几种复杂的互连结构，并向代码开发人员提供测试结果，作为与高性能仿真工具进行比较的基准。研究将首先涉及为高速数字、射频、微波和MEMS(微型机电系统)封装定义各种先进的3-D互连。将评估用于校准和互连去嵌入的当前测量技术的理论背景和实施细节。将开发新的测量技术，以克服现有方法的根本限制。这种方法将从混合的时域和频域技术发展而来。新方法将用于提供准确的校准，而不依赖于不切实际的包装假设。还将开发互连去嵌入和基于统计的互连表征。将制造几个结构，以便为新方法提供验证。研究的最后一部分将致力于在测量的互连特性和设计模拟工具之间建立联系。在这些链路中使用的一种新方法是空间映射技术，该技术已成功地用于一些微波电路的基于模拟的优化。***