Characterization of High-Density Interconnect Structures for High Speed Digital and Wireless Communications Applica- tions

9710568 Virga研究活动-这项研究旨在表征高密度互连和分布结构在紧凑型高速数字和无线通信电路封装中的性能行为，主要重点是为复杂的三维（3-D）多层互连结构开发先进的基于测量的表征技术。复杂互连的例子包括非理想（非圆形和非固体）多层通孔，许多紧密间隔的垂直导体，模糊按钮以及垂直和水平导体之间的过渡。嵌入式互连在封装中通常是不可访问的，因此目前没有办法直接测量单个结构。由于先进的高密度电路封装包含非常混合的信号技术，如数字、模拟和RF信号导体走线，因此必须开发混合测量方法来准确识别互连性能。当测量结果与先进的包装设计仿真工具相结合时，可以获得很高的回报。计算机辅助设计（CAD）和计算机辅助测试（CAT）的协调提高了首次设计的成功率，并使新颖、低成本的先进封装技术得以快速发展。这项研究将涉及时域和频域测量技术。这项工作需要在基于微波（散射参数）和基于微电子（独特电压和电流）的方法之间取得平衡。本研究的具体目标是开发基于时域和频域方法混合的先进测量方法，以及基于微波和微电子的方法，用于高速数字和无线电路中的三维嵌入式互连结构，开发测量特性与电路分析和设计仿真工具之间的联系，描述一些复杂的互连结构，并将测试结果提供给代码开发人员，作为与高性能仿真工具进行比较的基准。该研究将首先涉及为高速数字、射频、微波和MEMS（微机电系统）封装定义各种先进的3d互连。本文将评估当前校准和互连去嵌入测量技术的理论背景和实现细节。将开发新的测量技术，克服现有方法的基本限制。这种方法将从时域和频域杂交技术发展而来。新方法将用于提供准确的校准，而不依赖于不切实际的包装假设。互连去嵌入和基于统计的互连表征也将被开发。为了验证新方法，将制作几个结构。研究的最后一部分将致力于在测量的互连特性和设计仿真工具之间建立联系。在这些环节中使用的一种新方法是空间映射技术，该技术已成功地用于一些微波电路的基于仿真的优化。＊＊＊

9710568 Virga Research Activities - This research is directed at characterizing the performance behavior of high-density interconnect and distribution structures employed in compact high-speed digital and wireless communications circuit packages, The primary focus is to develop advanced measurement-based characterization techniques for complex, three-dimensional (3-D), multi-layer, interconnect structures. Examples of complex interconnects include non-ideal (non-circular and non solid) multi-layer vias, many closely-spaced vertical conductors, fuzz buttons, and transitions between vertical and horizontal conductors. Embedded interconnects are typically inaccessible in a package, thus there are currently no means to directly measure individual structures. Since advanced high-density circuit packages incorporate very mixed-signal technologies, such as digital, analog, and RF signal conductor traces, hybrid measurement methods must be developed to accurately identify interconnect performance. High payoff is achieved when measurement results are linked with advanced packaging design simulation tools. The coordination of computer-aided design (CAD) and computer aided test (CAT) results in improved first past design success and enables the rapid development of novel, low-cost advanced packaging technologies. The research will involve both time-domain and frequency-domain measurement techniques. The work will entail a balance between microwave-based (scattering parameters) and microelectronics-based (unique voltages and currents) methodologies. The specific objectives of this research are develop advanced measurement methodologies based upon a hybrid of time-domain and frequency-domain approaches as well as microwave and microelectronics based approaches for three dimensional embedded interconnect structures employed in high-speed digital and wireless circuits, develop links between measured characteristics and circuit analysis and design simulation tools, characterize a few complex inter connect structures and make test results available to code developers to be used as benchmarks for comparisons with high performance simulation tools. The research will first involve defining various advanced 3-D interconnects for high-speed digital, RF, microwave, and MEMS (Micro-Electromechanical Systems) packaging. The theoretical background and implementation details of current measurement techniques for calibration and interconnect de-embedding will be evaluated. New measurement techniques that overcome the fundamental limitations of existing methods will be developed. Such methods will be developed from hybridizing time-domain & frequency-domain techniques. The new methods will be used to provide accurate calibrations that do not rely on unrealistic packaging assumptions. Interconnect de-embedding and statistical-based interconnect characterization will also be developed. Several structures will be fabricated in order to provide validations to the new approaches. The last part of the research will be geared toward creating links between measured interconnect characteristics and design simulation tools. One novel approach to use in these links is the space-mapping technique that has been successfully used in the simulation-based optimization of some microwave circuits. ***