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SHF:Medium:Collaborative Research: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's

SHF:Medium:Collaborative Research: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's
SHF:Medium:协作研究:微流控 3D IC 的电热协同设计
批准号:
1302297
负责人:
Muhannad Bakir
金额:
$46.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-09-15 至 2019-02-28

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中文摘要
翻译
本课题的技术目标是开发和完善微流控三维集成电路冷却技术。虽然3D集成为提高电子系统的性能、能效和功能提供了巨大的潜力,但散热问题也显著加剧。传统的空气冷却将无法满足未来3D集成电路的散热要求。在这个项目中,pi正在研究使用侵略性微流体冷却技术来冷却3D集成电路。该团队由马里兰大学和佐治亚理工学院的研究人员组成。佐治亚理工学院的团队将在层间微流体冷却的3D集成电路的制造和建模方面提供重要的专业知识。马里兰团队将提供VLSI设计方法方面的专业知识。本提案的主要重点是:为3D集成电路的微流体嵌入式冷却和电气方面的共同设计开发技术和工具。该提案将直接支持几个不同学科的博士生。由于该提案的跨学科性质,这些学生需要学习有关流体学,芯片设计和热管理的各种主题。本科生也将参与乔治亚理工学院和马里兰大学的各种项目。这项研究的结果将发表在电子/计算机工程和机械工程领域的权威期刊上。工具、模型和实验数据也将在网上提供。pi计划在各种会议和教育论坛上组织辅导课。通过与当地hbcu的合作,将特别强调少数族裔的参与。
英文摘要
The technical goal of this project is to develop and refine the micro-fluidic 3D IC cooling technology. While 3D integration offers significant potential for improving the performance, energy efficiency and functionality of electronic systems, the problem of heat removal is significantly exacerbated. Conventional air cooling alone would be incapable of addressing the future 3D IC heat removal requirements. In this project, the PIs are investigating use of aggressive micro-fluidic cooling technology for cooling 3D ICs. The team comprises researchers from University of Maryland and Georgia Institute of Technology. The Georgia Tech team would bring forth significant expertise in fabrication and modeling of 3D ICs with interlayer micro-fluidic cooling. The Maryland team will bring forth expertise in VLSI design methodologies. The primary focus of this proposal is: development of techniques and tools for co-design of micro-fluidic embedded cooling and electrical aspects of 3D ICs.This proposal would directly support several PhD students in different disciplines. Because of the cross disciplinary nature of this proposal, these students would need to learn diverse set of topics pertaining to fluidics, chip design and thermal management. Undergraduates will also be involved through various programs at Georgia Tech and Maryland. The outcomes of this research will be published in respectable venues in both electrical/computer engineering and mechanical engineering. The tools, models and experimental data will also be made available on the web. The PIs plan to organize tutorials at various conferences and educational forums. Special emphasis will be givenon minority involvement via collaboration with local HBCUs.
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Heterogeneous Interconnect Stitching Technology (HIST) For High-Performance Computing Systems
  • 批准号:
    1810081
  • 项目类别:
    Standard Grant
  • 资助金额:
    $33.0万
  • 财政年份:
    2018
  • 负责人:
    Muhannad Bakir
  • 依托单位:
I-Corps: Dense Flexible Interconnects for Advanced Testing and Integration
  • 批准号:
    1620062
  • 项目类别:
    Standard Grant
  • 资助金额:
    $5.0万
  • 财政年份:
    2016
  • 负责人:
    Muhannad Bakir
  • 依托单位:
Interconnect Networks for Three-Dimensional Gigascale System-on-a-Chip
  • 批准号:
    0701560
  • 项目类别:
    Continuing Grant
  • 资助金额:
    $30.0万
  • 财政年份:
    2007
  • 负责人:
    Muhannad Bakir
  • 依托单位:
海外基金